MT47H64M16HR-3:HTR Micron Technology Inc, MT47H64M16HR-3:HTR Datasheet - Page 20
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H64M16HR-3:HTR
Manufacturer Part Number
MT47H64M16HR-3:HTR
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H64M16HR-3HTR.pdf
(136 pages)
Specifications of MT47H64M16HR-3:HTR
Lead Free Status / Rohs Status
Compliant
- Current page: 20 of 136
- Download datasheet (3Mb)
Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Notes:
A
9
8
7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
6.4 CTR
36%Pb, 2% Ag).
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
Ball A1 ID
11.5 ±0.1
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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