STM32F407IGT6 STMicroelectronics, STM32F407IGT6 Datasheet - Page 84

IC MCU 32BIT 1MB FLASH 176LQFP

STM32F407IGT6

Manufacturer Part Number
STM32F407IGT6
Description
IC MCU 32BIT 1MB FLASH 176LQFP
Manufacturer
STMicroelectronics
Datasheets

Specifications of STM32F407IGT6

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
168MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
140
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
192K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 24x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Core
ARM Cortex M4
Processor Series
STM32F4
Data Bus Width
32 bit
Maximum Clock Frequency
168 MHz
Data Ram Size
192 KB
On-chip Adc
Yes
Number Of Programmable I/os
140
Number Of Timers
10
Operating Supply Voltage
1.7 V to 3.6 V
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
24
Interface Type
CAN, I2C, I2S, SPI, UART
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11604

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Electrical characteristics
5.3.13
84/154
Table 36.
1. TBD stands for “to be defined”.
2. Guaranteed by design, not tested in production.
3. The maximum programming time is measured after 100K erase operations.
4. V
Table 37.
1. Based on characterization, not tested in production.
2. Cycling performed over the whole temperature range.
EMC characteristics
Susceptibility tests are performed on a sample basis during device characterization.
Functional EMS (electromagnetic susceptibility)
While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the
device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:
Symbol
t
t
t
ERASE128KB
ERASE16KB
ERASE64KB
N
t
Symbol
RET
t
END
VPP
V
PP
t
V
Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant
with the IEC 61000-4-4 standard.
t
I
prog
ME
prog
PP
PP
should only be connected during programming/erasing.
(4)
Endurance
Data retention
Parameter
Flash memory programming with V
Flash memory endurance and data retention
Double word programming
Sector (16 KB) erase time
Sector (64 KB) erase time
Sector (128 KB) erase time
Mass erase time
Programming voltage
V
Minimum current sunk on
the V
Cumulative time during
which V
PP
voltage range
PP
PP
Parameter
pin
is applied
T
T
1 kcycle
1 kcycle
10 kcycles
A
A
= –40 to +105 °C (7 suffix versions)
= –40 to +85 °C (6 suffix versions)
Doc ID 022152 Rev 1
(2)
(2)
(2)
at T
at T
at T
Conditions
A
A
= 85 °C
= 105 °C
A
T
= 55 °C
A
Conditions
= 0 to +40 °C
PP
(1)
STM32F405xx, STM32F407xx
Min
2.7
10
7
-
-
-
-
-
-
(2)
Value
Min
30
10
20
TBD
TBD
TBD
10
Typ
6.8
16
-
-
-
-
(1)
Max
100
DD
3.6
9
1
-
-
-
-
-
(3)
(2)
and V
kcycles
Years
Unit
Unit
hour
mA
µs
V
V
SS

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