SA2400ABE NXP Semiconductors, SA2400ABE Datasheet - Page 17

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SA2400ABE

Manufacturer Part Number
SA2400ABE
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SA2400ABE

Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Package Type
LQFP
Product Depth (mm)
7mm
Product Length (mm)
7mm
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SA2400ABE
Manufacturer:
PHI
Quantity:
1 370
Part Number:
SA2400ABE
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
12.4 Main output charge pumps and fractional
compensation currents (see Figure 7)
The main charge pumps on pin CP are driven by the main phase
detector and the charge pump current value is determined by bit CP
(Synthesizer Register C). The fractional compensation is derived
from the contents of the fractional accumulator FRD and by the
program value of the FDAC. The timing for the fractional
compensation is derived from the main divider. The charge pumps
will enter speed-up mode after sending a Synthesizer Register A
word and stays active until a different word is sent.
12.5 Principle of fractional compensation
The fractional compensation is designed into the circuit as a means
of reducing or eliminating fractional spurs that are caused by the
fractional phase ripple of the main divider. If I
compensation current and I
The compensation is done by sourcing a small current, I
Figure 8, that is proportional to the fractional error phase. For proper
fractional compensation, the area of the fractional compensation
current pulse must be equal to the area of the fractional charge
pump ripple. The width of the fractional compensation pulse is fixed
to 128 VCO cycles, the amplitude is proportional to the fractional
NOTE: For a proper fractional compensation, the area of the fractional compensation current pulse must be equal to the area of the charge pump ripple output.
2002 Nov 04
Single chip transceiver for 2.45 GHz ISM band
I
PUMP_TOTAL
REF. DIVIDER
OUTPUT R
MAIN DIVIDER
OUTPUT M
DETECTOR
OUTPUT
ACCUMULATOR
FRACTIONAL
COMPENSATION
CURRENT
OUTPUT ON
PUMP
= I
PUMP
PUMP
+ I
COMP
is the pump current:
PULSE LEVEL
MODULATION
.
PULSE
WIDTH
MODULATION
f
RF
Figure 7. Waveforms for NF = 2 Modulo 5
N
COMP
is the
MAIN DIVIDER
Figure 8. Current Injection Concept
f
REF
N
2
COMP
, see
N+1
17
4
I
PUMP
The power-on signal is defined by the bit ON in Synthesizer Register
ACCUMULATOR
accumulator value and is adjusted by FDAC values (bits FC7–0 in
Synthesizer B). The fractional compensation current is derived from
the main charge pump in that it follows all the current scaling through
programming or speed-up operation. For a given charge pump,
FRD is the fractional accumulator value.
The target values for FDAC are: 128 for FM = 1 (modulo 5) and
80 for FM = 0 (modulo 8).
12.6 Lock Detect
The output LOCK maintains a logic ‘1’ when main phase detector
indicates a lock condition. The lock condition is defined as a phase
difference of less than 1 period of the frequency at the input
XTAL_1, XTAL_2. Out of lock (logic ‘0’) is indicated when the
synthesizer is powered down.
12.7 Power-down mode
B. If ON = ‘1’, the synthesizer section is powered on/off as defined
by the chip mode (register 0x04). If ON = ‘0’, it is defined as inverted
to the chip mode. When the synthesizer is reactivated after
power-down, the main and reference dividers are synchronized to
avoid possibility of random phase errors on power-up.
FRACTIONAL
I
COMP
I
COMP
N
1
= (I
fraction =
PUMP
LOOP FILTER
& VCO
SR01800
/ 128) * (FDAC / 5*128) * FRD
2
/
3
5
N+1
0
mA
A
SA2400A
SR01416
Product data

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