ISP1761BE STEricsson, ISP1761BE Datasheet - Page 152
ISP1761BE
Manufacturer Part Number
ISP1761BE
Description
Manufacturer
STEricsson
Datasheet
1.ISP1761BE.pdf
(164 pages)
Specifications of ISP1761BE
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
LQFP
Rad Hardened
No
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISP1761BE
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
ISP1761_5
Product data sheet
18.4 Package related soldering information
Table 180. Suitability of through-hole mount IC packages for dipping and wave soldering
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Rev. 05 — 13 March 2008
Soldering method
Dipping
-
suitable
-
Hi-Speed USB OTG controller
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
ISP1761
[1]
151 of 163