PCF8578T NXP Semiconductors, PCF8578T Datasheet - Page 2
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PCF8578T
Manufacturer Part Number
PCF8578T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8578T.pdf
(48 pages)
Specifications of PCF8578T
Operating Supply Voltage (typ)
3.3/5V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Package Type
VSO
Pin Count
56
Mounting
Surface Mount
Power Dissipation
400mW
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
6V
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8578T
Manufacturer:
NXPL
Quantity:
2 359
Part Number:
PCF8578T
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8578T-1
Manufacturer:
PHILIPS
Quantity:
2 396
Part Number:
PCF8578T-1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
PCF8578T/1
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8578T/1,118
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
8
8.1
9
9.1
9.2
9.3
9.4
10
11
12
13
14
15
16
17
2003 Apr 14
LCD row/column driver for
dot matrix graphic displays
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Mixed mode
Row mode
Multiplexed LCD bias generation
Power-on reset
Internal clock
External clock
Timing generator
Row/column drivers
Display mode controller
Display RAM
Data pointer
Subaddress counter
I
Input filters
RAM access
Display control
TEST pin
I
Command decoder
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
CHIP DIMENSIONS AND BONDING PAD
LOCATIONS
CHIP-ON-GLASS INFORMATION
PACKAGE OUTLINES
2
2
APPLICATION INFORMATION
C-bus controller
C-BUS PROTOCOL
2
C-BUS
2
18
18.1
18.2
18.3
18.4
18.5
19
20
21
22
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
Product specification
2
C COMPONENTS
PCF8578