DSPA56371AF150B Freescale Semiconductor, DSPA56371AF150B Datasheet - Page 35

• Manufacturer Part Number: DSPA56371AF150B
• Manufacturer: Freescale Semiconductor

Specifications of DSPA56371AF150B

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Program Memory Size: 192KB
• Operating Supply Voltage (typ): 1.25/3.3V
• Operating Supply Voltage (min): 1.2/3.14V
• Operating Temp Range: -40C to 115C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: LQFP
• Lead Free Status / Rohs Status: Compliant

6
7
Freescale Semiconductor
Supply voltages
Supply voltages
Input high voltage
Note: All 3.3 V supplies must rise prior to the rise of the 1.25 V supplies to avoid a high current condition and
possible system damage.
Input low voltage
Input leakage current (All pins)
Clock pin Input Capacitance (EXTAL)
High impedance (off-state) input current
(@ 3.46 V)
Output high voltage
Output low voltage
Internal supply current
181MHz
• Core (core_vdd)
• PLL (plld_vdd)
• Vio_vdd
• PLL (pllp_vdd)
• PLL (plla_vdd)
• All pins
• All pins
• In Normal mode
I
I
Natural Convection, Junction-to-ambient thermal
resistance
Junction-to-case thermal resistance
Note:
OH
OL
= 5 mA
Thermal Characteristics
DC Electrical Characteristics
= -5 mA
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
SPEC-883 Method 1012.1).
1,2
Characteristics
Characteristic
1
at internal clock of
Table 16. DC ELECTRICAL CHARACTERISTICS
Table 15. Thermal Characteristics
3
DSP56371 Data Sheet, Rev. 4.1
Symbol
V
V
V
V
I
V
C
I
DDIO
V
I
CCI
TSI
OH
DD
IN
OL
IH
IN
IL
R
R
Symbol
θJC
θJA
–0.3
Min
3.14
–84
1.2
2.0
2.4
—
—
—
or θ
or θ
JA
JC
3.749
1.25
TQFP Value
Typ
3.3
99
—
—
—
—
—
—
18.25
39
4
V
IO_VDD+2V
Thermal Characteristics
3.46
Max
1.3
200
0.8
0.4
84
84
—
1
1
°
°
Unit
C/W
C/W
Unit
mA
µA
pF
µA
V
V
V
V
V
V
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