GS84118AT-100 GSI TECHNOLOGY, GS84118AT-100 Datasheet - Page 9

• Manufacturer Part Number: GS84118AT-100
• Manufacturer: GSI TECHNOLOGY

Specifications of GS84118AT-100

• Density: 4.5Mb
• Access Time (max): 12ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 66.7MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 140mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 18b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Package Thermal Characteristics
Notes:
1.
2.
3.
Rev: 1.02 4/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Junction temperature is a function of SRAM power dissapation, package thermal resistance, mounting board temperature, ambient.
Temperature air flow, board density, and PCB thermal resistance.
SCMI G-38-87.
Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.
Notes:
1.
2.
3.
4.
AC Test Conditions
(VDD = 3.135 V–3.6 V, Ta = 0–70°C)
Junction to Ambient (at 200 lfm)
Junction to Ambient (at 200 lfm)
Include scope and jig capacitance.
Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
Output load 2 for t
Device is deselected as defined by the Truth Table.
Junction to Case (TOP)
Output reference level
Input reference level
Input high level
Input slew rate
Input low level
Parameter
Rating
Output load
LZ
, t
HZ
, t
OLZ
and t
OHZ
.
Layer Board
single
Conditions
four
TR = 1 V/ns
—
V
V
Fig. 1& 2
IH
IL
1.25 V
1.25 V
= 2.3 V
= 0.2 V
9/20
Symbol
R
R
R
ΘJA
ΘJA
ΘJC
TQFP max
32
20
7
DQ
GS84118AT/B-166/150/130/100
DQ
PBGA max
Output load 1
Output load 2
F
IG
28
18
4
F
. 1
IG
5pF
. 2
VT = 1.25 V
1
2.5 V
© 2001, GSI Technology
50W 30pF
225W
225W
°C/W
°C/W
°C/W
Unit
Notes
1
1,2
1,2
3