S29GL064A90TFIR4 Spansion Inc., S29GL064A90TFIR4 Datasheet - Page 21

• Manufacturer Part Number: S29GL064A90TFIR4
• Manufacturer: Spansion Inc.

Specifications of S29GL064A90TFIR4

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

6.3
May 21, 2008 S29GL-A_00_A12
S29GL064A Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29GL064A
S29GL064A
Number
Device
Device Number/Description
S29GL064A, 64 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit
90
90, 10, 11
Option
Program, and Erase
Speed
T
S29GL064A Valid Combinations
A
Package, Material &
Temperature Range
D a t a
I
BAI, BFI
TAI, TFI
FAI, FFI
R1
Table 6.3 S29GL064A Valid Combinations
S h e e t
2
S29GL-A
Packing Type
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number
R1 = x8/x16, V
R2 = x8/x16, V
R3 = x8/x16, V
R4 = x8/x16, V
R5 = x16, V
R6 = x16, V
R7 = x16, V
R8 = x8/x16, V
R9 = x8/x16, V
Temperature Range
I
Package Material Set
A = Standard
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
Speed Option
See
R3, R4, R6, R7, R8, R9
R1, R2, R3, R4, R5
= Industrial (–40°C to +85°C)
Model Number
Product Selector Guide on page 9
protected when WP#/ACC=V
protected when WP#/ACC=V
protected when WP#/ACC=V
sectors protected when WP#/ACC=V
when WP#=V
when WP#=V
protected when WP#=V
protected when WP#=V
R3, R4, R5
R1, R2
CC
CC
CC
=3.0 – 3.6 V, Uniform sector device
=3.0 – 3.6 V, Uniform sector device, highest address sector protected
=3.0 – 3.6 V, Uniform sector device, lowest address sector protected
CC
CC
CC
CC
CC
CC
=3.0 – 3.6 V, Uniform sector device, highest address sector
=3.0 – 3.6 V, Uniform sector device, lowest address sector
=3.0 – 3.6 V, Top boot sector device, top two address sectors
=3.0 – 3.6 V, Bottom boot sector device, bottom two address
=3.0 – 3.6 V, Uniform sector device, highest address sector
=3.0 – 3.6 V, Uniform sector device, lowest address sector
IL
IL
(Note 1)
Packin
0, 2, 3
Type
IL,
IL,
g
TSO48 only
TSO48 only
IL
IL
IL
TS048
TS056
VBN048
LAA064
and Valid Combinations below
®
IL
(Note 2)
(Note 2)
Process Technology, 3.0 Volt-only Read,
(Note 3)
(Note 3)
Package Description
TSOP
TSOP
Fine-pitch BGA
Fortified BGA
21