BAS56 NXP Semiconductors, BAS56 Datasheet
BAS56
Specifications of BAS56
Available stocks
Related parts for BAS56
BAS56 Summary of contents
Page 1
... BAS56 High-speed double diode Rev. 3 — 29 June 2010 1. Product profile 1.1 General description Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package. The diodes are not connected. 1.2 Features and benefits High switching speed: t ...
Page 2
... Ordering information Package Name Description - plastic surface-mounted package; 4 leads Marking codes All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 BAS56 High-speed double diode Simplified outline Graphic symbol [1] Marking code *L5 © ...
Page 3
... High-speed double diode Min - [ [1] - [2][3] - [2][4] - [3] - [ μ 100 μ °C [2] - amb - −65 Min Typ [ © NXP B.V. 2010. All rights reserved. BAS56 Max Unit 60 V 120 120 V 200 mA 150 mA 600 mA 430 1.7 A 250 mW °C 150 °C +150 Max Unit 500 K/W 360 K ...
Page 4
... All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 High-speed double diode Min [ 150 ° [2] = 120 150 °C [2] = 120 [3] - [ 100 Ω; measured mA BAS56 Typ Max Unit - 100 nA μA - 100 - 100 nA μA - 100 - 2 1.5 V © NXP B.V. 2010. All rights reserved ...
Page 5
... Rev. 3 — 29 June 2010 High-speed double diode Based on square wave currents °C; prior to surge T j Non-repetitive peak forward current as a function of pulse duration ° MHz Diode capacitance as a function of reverse voltage; typical values © NXP B.V. 2010. All rights reserved. BAS56 mbg703 (μs) p mbh283 30 ( ...
Page 6
... All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 High-speed double diode mbg439 100 200 T (°C) amb input signal input signal BAS56 (1) output signal t output signal mga882 © NXP B.V. 2010. All rights reserved ...
Page 7
... Product data sheet 4 2.5 1.4 2.1 1.2 1 0.88 0.78 Dimensions in mm Package outline BAS56 (SOT143B) Packing methods Package Description SOT143B 4 mm pitch tape and reel All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 High-speed double diode 3.0 2 ...
Page 8
... NXP Semiconductors 11. Soldering 0.7 (3×) 0.7 Fig 9. 4.6 Fig 10. Wave soldering footprint BAS56 (SOT143B) BAS56 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 Reflow soldering footprint BAS56 (SOT143B) 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. ...
Page 9
... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAS56 v.3 20100629 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. ...
Page 10
... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 BAS56 High-speed double diode © NXP B.V. 2010. All rights reserved ...
Page 11
... Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 June 2010 BAS56 High-speed double diode © NXP B.V. 2010. All rights reserved ...
Page 12
... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAS56 All rights reserved. Date of release: 29 June 2010 Document identifier: BAS56 ...