PCF8578H NXP Semiconductors, PCF8578H Datasheet - Page 36

• Manufacturer Part Number: PCF8578H
• Manufacturer: NXP Semiconductors

Specifications of PCF8578H

• Operating Supply Voltage (typ): 3.3/5V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: LQFP
• Pin Count: 64
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 6V
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
15 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
2003 Apr 14
LCD row/column driver for
dot matrix graphic displays
Chip area: 14.93 mm
Bonding pad dimensions: 120 m
The numbers given in the small squares refer to the pad numbers.
2
.
4.88
mm
V LCD
OSC
V DD
C39
C38
C37
C36
C35
V 2
V 3
V 4
V 5
120 m.
10
11
12
13
14
15
16
17
18
19
20
7
8
9
21
6
Fig.28 Bonding pad locations.
22
5
23
4
24
3
PCF8578
3.06 mm
0
36
2
25
0
y
1
26
54
27
53
28
52
29
51
30
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
R5
R6
R7
R8/C8
R9/C9
R10/C10
R11/C11
R12/C12
R13/C13
R14/C14
R15/C15
R16/C16
R17/C17
R18/C18
R19/C19
R20/C20
R21/C21
R22/C22
MBH589
Product specification
x
PCF8578