UPD78F0034AGK-9ET Renesas Electronics America, UPD78F0034AGK-9ET Datasheet - Page 52

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UPD78F0034AGK-9ET

Manufacturer Part Number
UPD78F0034AGK-9ET
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of UPD78F0034AGK-9ET

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52
9. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
representative.
(1) µ PD78F0034AGC-8BS: 64-pin plastic LQFP (14 × 14)
(2) µ PD78F0034AGB-8EU: 64-pin plastic LQFP (10 × 10)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
Infrared reflow
VPS
Partial heating
The µ PD78F0034A, 78F0034AY should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
For soldering methods and conditions other than those recommended below, contact your NEC sales
Caution Do not use different soldering methods together (except for partial heating).
Note
Caution Do not use different soldering methods together (except for partial heating).
µ PD78F0034AYGC-8BS: 64-pin plastic LQFP (14 × 14)
µ PD78F0034AGC-AB8: 64-pin plastic QFP (14 × 14)
µ PD78F0034AYGC-AB8: 64-pin plastic QFP (14 × 14)
µ PD78F0034AYGB-8EU: 64-pin plastic LQFP (10 × 10)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less,
Exposure limit: 7 days
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less,
Exposure limit: 7 days
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Table 9-1. Surface Mounting Type Soldering Conditions (1/2)
Note
Note
(after 7 days, prebake at 125°C for 10 hours)
(after 7 days, prebake at 125°C for 10 hours)
Data Sheet U14040EJ4V0DS
Soldering Conditions
Soldering Conditions
µ PD78F0034A, 78F0034AY
IR35-00-2
VP15-00-2
WS60-00-1
IR35-107-2
VP15-107-2
Condition Symbol
Condition Symbol
Recommended
Recommended

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