TE28F160B3TA110 Intel, TE28F160B3TA110 Datasheet - Page 25

• Manufacturer Part Number: TE28F160B3TA110
• Manufacturer: Intel

Specifications of TE28F160B3TA110

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 110ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

4.2
Datasheet
Figure 3. TSOP Package Drawing
Dimensions
TSOP Package
NOTES:
1. One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Seating Plane Coplanarity
Package Body Thickness
Lead to Package Offset
Package Body Width
Pin 1
Terminal Dimension
Plastic Body Length
Lead Tip Length
Package Height
Lead Thickness
Lead Tip Angle
Lead Count
Lead Width
Lead Pitch
Standoff
Z
b
Detail B
See Detail A
See Notes 1, 2, 3 and 4
Symbol
D1
A1
A2
A
E
D
N
Ø
Y
Z
b
c
e
L
Family: Thin Small Out -Line Package
18.200 18.400 18.600
11.800 12.000 12.200
19.800 20.000 20.200
D
0.050
0.950
0.150
0.100
0.500
0.150
D
Min
1
0°
Millimeters
1.000
0.200
0.150
0.500
0.600
0.250
Nom
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
48
3°
1.200
1.050
0.300
0.200
0.700
0.100
0.350
Detail A
Max
5°
Notes
A
L
E
0.002
0.037
0.006
0.004
0.717
0.465
0.780
0.020
0.006
Min
0°
C
A
2
0
Inches
0.0197
0.039
0.008
0.006
0.724
0.472
0.787
0.024
0.010
Nom
48
3°
0.047
0.041
0.012
0.008
0.732
0.480
0.795
0.028
0.004
0.014
Seating
Plane
Max
A
5°
e
1
See Detail B
Notes
Y
A5568-02
25