XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 58

• Manufacturer Part Number: XPC850ZT50B
• Manufacturer: Freescale Semiconductor

Specifications of XPC850ZT50B

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Operating Supply Voltage (min): 3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

Ethernet Electrical Specifications
58
1
2
Num
133
134
138
139
The ratios SyncCLK/RCLKx and SyncCLK/TCLKx must be greater or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame destination address into memory.
TENA active delay (from TCLKx rising edge)
TENA inactive delay (from TCLKx rising edge)
CLKOUT low to SDACK asserted
CLKOUT low to SDACK negated
Figure 8-53. Ethernet Collision Timing Diagram
Figure 8-54. Ethernet Receive Timing Diagram
Table 8-20. Ethernet Timing (continued)
Freescale Semiconductor, Inc.
MPC850 (Rev. A/B/C) Hardware Specifications
For More Information On This Product,
Characteristic
Go to: www.freescale.com
2
2
All Frequencies
10.00
10.00
Min
—
—
50.00
50.00
20.00
20.00
Max
MOTOROLA
Unit
ns
ns
ns
ns