JS28F128P30T85 Micron Technology Inc, JS28F128P30T85 Datasheet - Page 11
JS28F128P30T85
Manufacturer Part Number
JS28F128P30T85
Description
Manufacturer
Micron Technology Inc
Datasheet
1.JS28F128P30T85.pdf
(97 pages)
Specifications of JS28F128P30T85
Cell Type
NOR
Density
128Mb
Access Time (max)
85/17ns
Interface Type
Parallel/Serial
Boot Type
Top
Address Bus
23b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
1.7 to 2/8.5 to 9.5V
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
2V
Word Size
16b
Number Of Words
8M
Supply Current
28mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Compliant
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P30
Table 6:
2.2
Figure 2:
August 2008
Order Number: 306666-12
Product Information
Lead Tip Length
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
4.
E
Ball A1
Corner
A2
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology
http://developer.Numonyx.com/design/flash/packtech.
C
D
E
G
H
A
B
F
TSOP Package Dimensions (Sheet 2 of 2)
Easy BGA Mechanical Specifications
64-Ball Easy BGA Package
1
Top View - Ball side down
A1
2
3
Symbol
4
D
N
L
ý
Y
Z
5
6
0.500
0.150
Min
0°
-
-
7
8
Millimeters
0.600
0.250
Nom
56
3°
-
A
A
B
C
D
G
H
E
F
8
0.700
0.100
0.350
Seating
Plane
Max
5°
-
Bottom View - Ball Side Up
7
6
0.020
0.006
Min
0°
5
-
-
Note: Drawing not to scale
4
Inches
3
0.024
0.010
Nom
56
3°
-
2
1
Y
S1
0.004
0.028
0.014
Max
5°
-
Ball A1
Corner
b
e
S2
Datasheet
Notes
11
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