CY7C1361B-100AJC Cypress Semiconductor Corp, CY7C1361B-100AJC Datasheet - Page 7
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CY7C1361B-100AJC
Manufacturer Part Number
CY7C1361B-100AJC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1361B-100AJC.pdf
(34 pages)
Specifications of CY7C1361B-100AJC
Density
9Mb
Access Time (max)
8.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
100MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
18b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
180mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
256K
Lead Free Status / Rohs Status
Not Compliant
Document #: 38-05302 Rev. *B
CY7C1361B–Pin Definitions
A
BW
BW
GW
CLK
CE
CE
CE
OE
ADV
ADSP
0
, A
Name
1
2
3
A,
C,
[2]
1
BW
BW
, A
B
D
37,36,32,33,
34,35,43,44,
45,46,47,48,
49,50,81,82,
93,94,95,96 93,94,95,96 L5,G5,G3,
Enable)
(3-Chip
99,100
TQFP
88
89
98
97
92
86
83
84
37,36,32,33,
34,35,44,45,
46,47,48,49,
50,81,82,92,
Enable)
(2-Chip
99,100
TQFP
88
89
98
97
86
83
84
–
P4,N4,A2,
C2,R2,A3,
B3,C3,T3,
T4,A5,B5,
C5,T5,A6,
B6,C6,R6
Enable)
(2-Chip
BGA
H4
E4
B2
G4
A4
L3
K4
F4
–
A10,B2,B10,
P9,P10,P11,
R9,R10,R11
R3,R4,R8,
R6,P6,A2,
P3,P4,P8,
B5,A5,A4,
Enable)
(3-Chip
fBGA
B4
B7
B6
A3
B3
A6
B8
A9
B9
Asynchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Clock
I/O
Address Inputs used to select one of the
256K address locations. Sampled at the
rising edge of the CLK if ADSP or ADSC is
active LOW, and CE
sampled active. A
Byte Write Select Inputs, active LOW. Qual-
ified with BWE to conduct byte writes to the
SRAM. Sampled on the rising edge of CLK.
Global Write Enable Input, active LOW.
When asserted LOW on the rising edge of
CLK, a global write is conducted (ALL bytes
are written, regardless of the values on
BW
Clock Input. Used to capture all
synchronous inputs to the device. Also used
to increment the burst counter when ADV is
asserted LOW, during a burst operation.
Chip Enable 1 Input, active LOW. Sampled
on the rising edge of CLK. Used in
conjunction with CE
select/deselect the device. ADSP is ignored
if CE
Chip Enable 2 Input, active HIGH.
Sampled on the rising edge of CLK. Used in
conjunction with CE
select/deselect the device.
Chip Enable 3 Input, active LOW. Sampled
on the rising edge of CLK. Used in
conjunction with CE
deselect the device.
Output Enable, asynchronous input,
active LOW. Controls the direction of the I/O
pins. When LOW, the I/O pins behave as
outputs. When deasserted HIGH, I/O pins
are three-stated, and act as input data pins.
OE is masked during the first clock of a read
cycle when emerging from a deselected state.
Advance Input signal, sampled on the
rising edge of CLK. When asserted, it
automatically increments the address in a
burst cycle.
Address Strobe from Processor, sampled
on the rising edge of CLK, active LOW.
When asserted LOW, addresses presented
to the device are captured in the address
registers. A
counter. When ADSP and ADSC are both
asserted, only ADSP is recognized. ASDP is
ignored when CE
[A:D]
1
is HIGH.
and BWE).
[1:0]
are also loaded into the burst
Description
1
[1:0]
is deasserted HIGH.
2
1
1
1
, CE
and CE
and CE
and CE
feed the 2-bit counter.
CY7C1361B
CY7C1363B
2
, and CE
3
3
2
[2]
[2]
to select/
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