CY7C1361B-100AJC Cypress Semiconductor Corp, CY7C1361B-100AJC Datasheet - Page 24

• Manufacturer Part Number: CY7C1361B-100AJC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1361B-100AJC

• Density: 9Mb
• Access Time (max): 8.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 100MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 180mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05302 Rev. *B
AC Test Loads and Waveforms
Note:
Thermal Resistance
Capacitance
14. Tested initially and after any design or process change that may affect these parameters.
C
C
C
IN
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
3.3V I/O Test Load
2.5V I/O Test Load
Θ
Θ
JA
JC
[14]
Z
Z
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
0
0
= 50Ω
= 50Ω
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Description
(a)
(a)
V
V
[14]
L
Description
L
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA / JESD51.
INCLUDING
INCLUDING
JIG AND
T
V
V
JIG AND
SCOPE
SCOPE
A
DD
DDQ
Test Conditions
5 pF
5 pF
= 25°C, f = 1 MHz,
= 3.3V.
Test Conditions
= 2.5V
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R =1538Ω
V
Package
Package
GND
GND
DD
TQFP
V
TQFP
25
DD
9
≤ 1ns
≤ 1ns
5
5
5
10%
10%
Package
Package
ALL INPUT PULSES
ALL INPUT PULSES
BGA
BGA
25
5
5
7
6
90%
90%
(c)
(c)
Package
Package
fBGA
CY7C1361B
CY7C1363B
fBGA
27
5
5
7
6
Page 24 of 34
90%
90%
10%
10%
°C/W
°C/W
Unit
≤ 1ns
≤ 1ns
Unit
pF
pF
pF
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