CY7C1361B-100AJC Cypress Semiconductor Corp, CY7C1361B-100AJC Datasheet - Page 30

• Manufacturer Part Number: CY7C1361B-100AJC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1361B-100AJC

• Density: 9Mb
• Access Time (max): 8.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 100MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 180mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05302 Rev. *B
Ordering Information
Shaded areas contain advance information. Please contact your local sales representative for availability of these parts.
Speed
(MHz)
117
100
CY7C1361B-117AC
CY7C1363B-117AC
CY7C1361B-117AI
CY7C1363B-117AI
CY7C1361B-117AJC
CY7C1363B-117AJC
CY7C1361B-117AJI
CY7C1363B-117AJI
CY7C1361B-117BGC
CY7C1363B-117BGC
CY7C1361B-117BGI
CY7C1363B-117BGI
CY7C1361B-117BZC
CY7C1363B-117BZC
CY7C1361B-117BZI
CY7C1363B-117BZI
CY7C1361B-100AC
CY7C1363B-100AC
CY7C1361B-100AI
CY7C1363B-100AI
CY7C1361B-100AJC
CY7C1363B-100AJC
CY7C1361B-100AJI
CY7C1363B-100AJI
CY7C1361B-100BGC
CY7C1363B-100BGC
CY7C1361B-100BGI
CY7C1363B-100BGI
CY7C1361B-100BZC
CY7C1363B-100BGC
CY7C1361B-100BZI
CY7C1363B-100BGI
Ordering Code
(continued)
Package
BB165A
BB165A
BB165A
BB165A
BG119
BG119
BG119
BG119
Name
A101
A101
A101
A101
A101
A101
A101
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
2 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
2 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
2 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
2 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
Part and Package Type
CY7C1361B
CY7C1363B
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Page 30 of 34
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