CY7C1373B-100AC Cypress Semiconductor Corp, CY7C1373B-100AC Datasheet - Page 5

• Manufacturer Part Number: CY7C1373B-100AC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1373B-100AC

• Density: 18Mb
• Access Time (max): 8.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Supply Current: 225mA
• Operating Supply Voltage (min): 3.14V
• Operating Supply Voltage (max): 3.63V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 18b
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05198 Rev. **
Pin Definitions
A0
A1
A
BWSa
BWSb
BWSc
BWSd
WE
ADV/LD
CLK
CE
CE
CE
OE
CEN
DQa
DQb
DQc
DQd
DPa
DPb
DPc
DPd
ZZ
MODE
V
V
V
TDO
DD
DDQ
SS
Name
1
2
3
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-Clock
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Asynchronous
Input-
Synchronous
I/O-
Synchronous
I/O-
Synchronous
Input-
Asynchronous
Input Pin
Power Supply
I/O Power
Supply
Ground
JTAG serial output
Synchronous
I/O Type
Address inputs used to select one of the 532,288/1,048,576 address locations. Sampled
at the rising edge of the CLK.
Byte Write Select inputs, active LOW. Qualified with WE to conduct Writes to the SRAM.
Sampled on the rising edge of CLK. BWSa controls DQa and DPa, BWSb controls DQb and
DPb, BWSc controls DQc and DPc, BWSd controls DQd and DPd.
Write enable input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW.
This signal must be asserted LOW to initiate a Write sequence.
Advance/Load input used to advance the on-chip address counter or load a new address.
When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW,
a new address can be loaded into the device for an access. After being deselected, ADV/LD
should be driven LOW in order to load a new address.
Clock input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN.
CLK is only recognized if CEN is active LOW.
Chip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
Chip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE
Chip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
Output enable, active LOW. Combined with the synchronous logic block inside the device
to control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as
outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE is
masked during the data portion of a Write sequence, during the first clock when emerging
from a deselected state and when the device has been deselected.
Clock enable input, active LOW. When asserted LOW the clock signal is recognized by the
SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory
location specified by A
the pins is controlled by OE and the internal control logic. When OE is asserted LOW, the
pins can behave as outputs. When HIGH, DQa – DQd are placed in a three-state condition.
The outputs are automatically three-stated during the data portion of a Write sequence, during
the first clock when emerging from a deselected state, and when the device is deselected,
regardless of the state of OE. DQ a, b, c and d are eight-bits wide.
Bidirectional Data Parity I/O lines. Functionally, these signals are identical to DQ
During Write sequences, DPa is controlled by BWSa, DPb is controlled by BWSb, DPc is
controlled by BWSc, and DPd is controlled by BWSd. DP a, b, c and d are one-bit wide.
ZZ “sleep” input. This active HIGH input places the device in a non-time critical “sleep”
condition with data integrity preserved.
Mode input. Selects the burst order of the device. Tied HIGH selects the interleaved burst
order. Pulled LOW selects the linear burst order. MODE should not change states during
operation. When left floating MODE will default HIGH, to an interleaved burst order.
Power supply inputs to the core of the device.
Power supply for the I/O circuitry.
Ground for the device. Should be connected to ground of the system.
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK (BGA only).
2
1
1
and CE
and CE
and CE
2
3
3
to select/deselect the device.
to select/deselect the device.
to select/deselect the device.
[X]
during the previous clock rise of the Read cycle. The direction of
Description
CY7C1371B
CY7C1373B
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