AM29LV640MB90REI Spansion Inc., AM29LV640MB90REI Datasheet - Page 10

• Manufacturer Part Number: AM29LV640MB90REI
• Manufacturer: Spansion Inc.

Specifications of AM29LV640MB90REI

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP and BGA). The package
8
RY/BY#
WE#
A13
NC
A6
A9
A5
A4
A3
A2
A1
NC
A8
A7
A7
A3
WP#/ACC
RESET#
A12
A17
NC
B6
B5
B4
B3
B2
B1
NC
A8
B8
B7
A4
A14
A10
A21
A18
NC
NC
C8
C7
C6
C5
C4
C3
A6
C2
A2
C1
D A T A
64-Ball Fortified BGA (
Am29LV640MT/B
Top View, Balls Facing Down
A15
A11
A19
A20
NC
NC
D8
D7
D6
D5
D4
D3
D2
D1
A5
A1
S H E E T
DQ7
DQ5
DQ2
DQ0
A16
V
NC
and/or data integrity can be compromised if the package
body is exposed to temperatures above 150°C for
prolonged periods of time.
A0
E8
E7
E6
E5
E4
E3
E2
E1
SS
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
NC
NC
f
F8
F7
F6
F5
F4
F3
F2
F1
BGA)
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
NC
NC
G8
G7
G6
G5
G4
G3
G2
G1
CC
DQ6
DQ4
DQ3
DQ1
V
V
NC
H8
NC
H7
H6
H5
H4
H3
H2
H1
SS
SS
26190C8 February 1, 2007