AM29F016D-90SC AMD (ADVANCED MICRO DEVICES), AM29F016D-90SC Datasheet - Page 8
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AM29F016D-90SC
Manufacturer Part Number
AM29F016D-90SC
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.AM29F016D-90SC.pdf
(13 pages)
Specifications of AM29F016D-90SC
Lead Free Status / Rohs Status
Not Compliant
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD
sales office to confirm availability of specific valid combinations and to check on newly released combinations.
March 3, 2009 26244A4
Am29F016D
DEVICE NUMBER/DESCRIPTION
Am29F016D Known Good Die
16 Megabit (2 M x 8-Bit) CMOS Flash Memory—Die Revision 1
5.0 Volt-only Program and Erase
-120
DP
AM29F016D-120
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C
I
PACKAGE TYPE AND MINIMUM ORDER QUANTITY
DP
DF
DR
DT
WF
WJ
SPEED OPTION
See Product Selector Guide and Valid Combinations
Am29F016D Known Good Die
S U P P L E M E N T
=
=
=
=
=
=
=
=
Valid Combinations
Commercial (0°C to +70°C)
Waffle Pack
500 µm thickness, 180 die per 5 tray stack
Waffle Pack
280 µm thickness, 180 die per 5 tray stack
Surftape™ (Tape and Reel)
280 µm thickness, 2500 per 7-inch reel
Surftape™ (Tape and Reel)
500 µm thickness, 2500 per 7-inch reel
Wafer Jar, 280 µm thickness
Wafer Jar, 500 µm thickness
Industrial (–40
°
C to +85
WFC 1, WFI 1,
DRC 1, DRI 1,
DPC 1, DPI 1,
DFC 1, DFI 1,
DTC 1, DTI 1,
WJC 1, WJI 1
°
C)
8