AM29F016D-90SC AMD (ADVANCED MICRO DEVICES), AM29F016D-90SC Datasheet - Page 11

• Manufacturer Part Number: AM29F016D-90SC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29F016D-90SC

• Lead Free Status / Rohs Status: Not Compliant

PHYSICAL SPECIFICATIONS
Die Dimensions, X x Y . . . . 186.61 mils x 208.66 mils
Die Thickness. . . . . . . . . . . . . . . . . 500 µm = ~20 mils
Bond Pad Size . . . . . . . . . . . . . . 3.52 mils x 3.52 mils
Pad Area Free of Passivation . . . . . . . . . .15.52 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias . .T
Operating Temperature
11
. . . . . . . . . . . . . . . . . . . . . . . . . . . 4.74 mm x 5.30 mm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 µm = ~11 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 89.3 µm x 89.3 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 µm
CC
Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
(Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
may be grounded (optional)
J
(max) = 130°C
Am29F016D Known Good Die
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Wafer Sort Test . . . . . . . . . . . . . . . . . . Sunnyvale, CA
Manufacturing ID . . . . . . . . . . . . . . . . . . . . . 98J32AK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS49HS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia
26244A4 March 3, 2009