M27C1001-70B1 ST Microelectronics, M27C1001-70B1 Datasheet - Page 5

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M27C1001-70B1

Manufacturer Part Number
M27C1001-70B1
Description
Manufacturer
ST Microelectronics
Datasheet

Specifications of M27C1001-70B1

Density
1Mb
Organization
128Kx8
Bus Type
Parallel
In System Programmable
External
Reprogramming Technique
OTP
Access Time (max)
70ns
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Supply Current
50mA
Package Type
PDIP
Pin Count
32
Mounting
Through Hole
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M27C1001-70B1
Manufacturer:
ST
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M27C1001
1
Summary description
The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organized as 131,072 words of 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid that enables the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C1001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK®
packages. ECOPACK packages are Lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.
See
signals connected to this device.
Figure 1.
Figure 1: Logic Diagram
Logic Diagram
A0-A16
and
G
P
E
Table 1: Signal Descriptions
17
V CC
M27C1001
V SS
V PP
8
Q0-Q7
AI00710B
for a brief overview of the
Summary description
5/24

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