LFXP6E-4Q208C Lattice, LFXP6E-4Q208C Datasheet - Page 394
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LFXP6E-4Q208C
Manufacturer Part Number
LFXP6E-4Q208C
Description
IC FPGA 5.8KLUTS 142I/O 208-PQFP
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP6E-4Q208C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP6E-4Q208C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
Revision History
September 2006
September 2010
November 2005
February 2010
January 2005
August 2010
March 2008
March 2010
June 2006
May 2009
Date
Version
01.0
01.1
01.2
01.3
01.4
01.5
01.6
01.7
01.8
01.9
Initial release.
Figures updated.
Removed NSMD content.
Added note to BGA Board Layout Recommendations table.
Reformatted BGA Package Types section in tabular format.
Revised recommended Solder Mask Defined and Non Solder Mask
Defined PCB solder pad dimensions to match industry standards.
Updated BGA Board Layout Recommendations table and BGA Pack-
age Types table for 0.4 mm pitch ucBGA package.
Edits to most sections and additional links and graphics added for each
example.
Replaced Lattice BGA Naming Conventions table with Lattice Semicon-
ductor BGA Package Types table and SMD/NSMD Pad Recommenda-
tions table.
Lattice Semiconductor SMD/NSMD Pad Recommendations table:
Specified nominal Solder Mask Opening for each Lattice BGA package,
clarified recommended Solder Mask Opening and Solder Pad Diame-
ters and added cautionary note.
Lattice Semiconductor SMD/NSMD Pad Recommendations table -
Added 64 csBGA to 0.5mm pitch column.
14-19
Change Summary
PCB Layout Recommendations
for BGA Packages
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