PVX003A0X3-SRZ Lineage Power, PVX003A0X3-SRZ Datasheet - Page 22

• Manufacturer Part Number: PVX003A0X3-SRZ
• Description: DC/DC Converters & Regulators 3-14.4Vin .6-5.5V 3A Neg Logic SMT Analog
• Manufacturer: Lineage Power
• Series: PVXr

Specifications of PVX003A0X3-SRZ

• Product: Non-Isolated / POL
• Input Voltage Range: 3 VDC to 14.4 VDC
• Number Of Outputs: 1
• Output Voltage (channel 1): 0.6 VDC to 5.5 VDC
• Output Current (channel 1): 3 A
• Package / Case Size: 12.2 mm x 12.2 mm x 6.25 mm
• Output Type: Non-Isolated
• Output Voltage: 0.6 VDC to 5.5 VDC
• Lead Free Status / Rohs Status: Details

Preliminary Data Sheet
January 19, 2012
Surface Mount Information
Pick and Place
The 12VAnalog Pico DLynx
open frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process.
Lead Free Soldering
The 12VAnalog Pico DLynx
free (Pb-free) and RoHS compliant and
free and a SnPb soldering process
observe the instructions below may result in the failure
of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 5-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
For questions regarding LGA, solder volume; please
contact Lineage Power for special manufacturing
process instructions.
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 48. Soldering outside of the
recommended profile requires testing to verify results
and performance.
It is recommended that the pad layout include a test
pad where the output pin is in the ground plane.
LINEAGE
are both forward and backward compatible in a Pb-
POWER
o
C. The label also carries
TM
TM
3A modules use an
3A modules are lead-
3A Analog Pico DLynx
. Failure to
3 – 14.4Vdc input; 0.6Vdc to 5.5Vdc output; 3A output current
The thermocouple should be attached to this test
pad since this will be the coolest solder joints. The
temperature of this point should be:
Maximum peak temperature is 260 C.
Minimum temperature is 235 C.
Dwell time above 217 C: 60 seconds minimum
Dwell time above 235 C: 5 to 15 second
MSL Rating
The 12VAnalog Pico DLynx
rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. B (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 48. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
TM
: Non-isolated DC-DC Power Modules
TM
3A modules have a MSL
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