ADG787BRMZ Analog Devices Inc, ADG787BRMZ Datasheet - Page 15

• Manufacturer Part Number: ADG787BRMZ
• Description: IC MUX/DEMUX DUAL 2X1 10MSOP
• Manufacturer: Analog Devices Inc
• Type: Analog Switchr

Specifications of ADG787BRMZ

• Function: Multiplexer/Demultiplexer
• Circuit: 2 x 2:1
• On-state Resistance: 3 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Current - Supply: 0.005µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Analog Switch Type: SPDT
• No. Of Channels: 2
• Bandwidth: 145MHz
• On State Resistance Max: 3.45ohm
• Turn Off Time: 3ns
• Turn On Time: 13ns
• Supply Voltage Range: 1.8V To 5.5V
• Multiplexer Configuration: Dual SPDT
• Number Of Inputs: 2
• Number Of Outputs: 4
• Number Of Channels: 2
• Analog Switch On Resistance: 5.75@3.6VOhm
• Analog Switch Turn On Time: 30ns
• Analog Switch Turn Off Time: 6ns
• Package Type: MSOP
• Power Supply Requirement: Single
• Single Supply Voltage (min): 1.8V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 0.0001W
• Supply Current: 0.001mA
• Mounting: Surface Mount
• Pin Count: 10
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ORDERING GUIDE
Model
ADG787BRMZ
ADG787BRMZ-500RL7
ADG787BRMZ-REEL
ADG787BCBZ-500RL7
ADG787BCBZ-REEL
ADG787BCPZ-500RL7
ADG787BCPZ-REEL
1
2
Due to space constraints, branding on this package is limited to three characters.
Z = Pb-free part.
2
IDENTIFIER
BALL 1
2
2
2
2
2
2
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–25°C to +85°C
–25°C to +85°C
–40°C to +85°C
–40°C to +85°C
(BALL SIDE DOWN)
TOP VIEW
1.56
1.50
1.44
Figure 40. 10-Ball Wafer Level Chip Scale Package [WLCSP]
Package Description
10-Lead Mini Small Outline Package (MSOP)
10-Lead Mini Small Outline Package (MSOP)
10-Lead Mini Small Outline Package (MSOP)
10-Ball Wafer Level Chip Scale Package (WLCSP)
10-Ball Wafer Level Chip Scale Package (WLCSP)
10-Lead Lead Frame Chip Scale Package (LFCSP_WD)
10-Lead Lead Frame Chip Scale Package (LFCSP_WD)
2.06
2.00
1.94
Dimensions shown in millimeters
Rev. A | Page 15 of 16
(CB-10)
0.63
0.57
0.51
0.26
0.22
0.18
0.50 BSC
BALL PITCH
SEATING
PLANE
0.36
0.32
0.28
0.11
0.09
0.07
C
(BALL SIDE UP)
BOTTOM
VIEW
B
Package Option
RM-10
RM-10
RM-10
CB-10
CB-10
CP-10-9
CP-10-9
A
2
3
4
1
Branding
SM1
SM1
SM1
S04
S04
SM1
SM1
ADG787
1