AT32UC3C2512C-Z2ZT Atmel, AT32UC3C2512C-Z2ZT Datasheet - Page 89

• Manufacturer Part Number: AT32UC3C2512C-Z2ZT
• Description: Microcontrollers (MCU) 512KB FL,-40/125oC AUTO
• Manufacturer: Atmel

Specifications of AT32UC3C2512C-Z2ZT

• Lead Free Status / Rohs Status: Details

8. Mechanical Characteristics
8.1
8.1.1
8.1.2
9166BS–AVR-02/11
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
JA
JC
89.
Table 8-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
89.
θ
HEATSINK
JA
)
50.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
No air flow
No air flow
No air flow
No air flow
TQFP100
TQFP100
LQFP144
LQFP144
Package
TQFP64
TQFP64
QFN64
QFN64
AT32UC3C
Table 8-1 on page
20.0
40.5
39.3
38.1
Typ
0.8
8.7
8.5
8.4
”Power
J
°C/W
°C/W
°C/W
°C/W
in °C.
Unit
89