HTMS8001FTK/AF,115 NXP Semiconductors, HTMS8001FTK/AF,115 Datasheet - Page 6

• Manufacturer Part Number: HTMS8001FTK/AF,115
• Description: RFID HITAG TRANSPONDER 2HVSON
• Manufacturer: NXP Semiconductors

Specifications of HTMS8001FTK/AF,115

• Function: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
5. Pinning information
152931
Product data sheet
PUBLIC
Table 2.
Note: All pads except LA and LB are electrically disconnected after dicing.
Description
(X) chip size
(Y) chip size
(1) pad center to chip edge
(2) pad center to chip edge
(3) pad center to chip edge
(4) pad center to chip edge
(5) pad center to chip edge
(6) pad center to chip edge
Bump Size:
LA, LB
Remaining pads
Fig 2.
HITAG µ - Mega bumps bondpad locations
HITAG µ - Mega bumps dimensions
(2)
(1)
Rev. 3.1 — 21 January 2010
(4)
LA
152931
(6)
(X)
(6)
(3)
Dimension
550 µm
550 µm
100.5 µm
48.708 µm
180.5 µm
55.5 µm
48.508 µm
165.5 µm
294 x 164 µm
60 x 60 µm
LB
(4)
(1)
(5)
001aaj823
© NXP B.V. 2010. All rights reserved.
(Y)
HITAG µ
Transponder IC
6 of 58