MT8VDDT6464HDY-40BJ1 Micron Technology Inc, MT8VDDT6464HDY-40BJ1 Datasheet - Page 4
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT8VDDT6464HDY-40BJ1
Manufacturer Part Number
MT8VDDT6464HDY-40BJ1
Description
MODULE DDR SDRAM 512MB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r
Specifications of MT8VDDT6464HDY-40BJ1
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
400MT/s
Features
-
Package / Case
200-SODIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Table 6:
PDF: 09005aef80765fab/Source: 09005aef806e1d28
DD8C32_64x64HD.fm - Rev. E 11/08 EN
RAS#, CAS#, WE#
DQS0–DQS7
CKE0, CKE1
DQ0–DQ63
CK0, CK0#,
DM0–DM7
CK1, CK1#
BA0, BA1
SA0–SA2
Symbol
S0#, S1#
A0–A12
V
Pin Descriptions
SDA
DDSPD
V
V
SCL
V
NC
REF
DD
SS
Supply
Supply
Supply
Supply
Input
Input
Input
Input
Input
Input
Input
Input
Input
Type
I/O
I/O
I/O
–
Description
Address inputs: Provide the row address for ACTIVE commands, and the
column address and auto precharge bit (A10) for READ/WRITE commands, to
select one location out of the memory array in the respective device bank. A10
sampled during a PRECHARGE command determines whether the PRECHARGE
applies to one device bank (A10 LOW, device bank selected by BA0 and BA1)
or all device banks (A10 HIGH). The address inputs also provide the op-code
during a MODE REGISTER SET command. BA0 and BA1 define which mode
register (mode register or extended mode register) is loaded during the LOAD
MODE REGISTER command.
Bank address: BA0 and BA1 define the device bank to which an ACTIVE,
READ, WRITE, or PRECHARGE command is being applied.
Clock: CK and CK# are differential clock inputs. All control, command, and
address input signals are sampled on the crossing of the positive edge of CK
and the negative edge of CK#. Output data (DQ and DQS) is referenced to the
crossings of CK and CK#.
Clock enable: CKE enables (registered HIGH) and CKE disables (registered
LOW) the internal clock, input buffers, and output drivers.
Input data mask: DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH, along with that input data, during a write
access. DM is sampled on both edges of DQS. Although DM pins are input-only,
the DM loading is designed to match that of DQ and DQS pins.
Command inputs: RAS#, CAS#, and WE# (along with S#) define the command
being entered.
Chip selects: S# enables (registered LOW) and disables (registered HIGH) the
command decoder.
Presence-detect address inputs: These pins are used to configure the SPD
EEPROM address range on the I
Serial clock for SPD EEPROM: SCL is used to synchronize the presence-detect
data transfer to and from the module.
Data input/output: Data bus.
Data strobe: Output with read
write data. Center-aligned with write data. Used to capture data.
Serial data: SDA is a bidirectional pin used to transfer addresses and data into
and out of the presence-detect portion of the module.
Power supply: +2.5V ±0.2V (-40B: +2.6V ±0.1V).
Serial EEPROM power supply: +2.3V to +3.6V.
SSTL_2 reference voltage (V
Ground.
No connect: These pins are not connected on the module.
256MB, 512MB (x64, DR): 200-Pin DDR SDRAM SODIMM
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
/2).
Pin Assignments and Descriptions
2
data.
C bus.
Edge-aligned with read data. Input with
©2004 Micron Technology, Inc. All rights reserved.