MT8VDDT6464HDY-40BJ1 Micron Technology Inc, MT8VDDT6464HDY-40BJ1 Datasheet - Page 10

• Manufacturer Part Number: MT8VDDT6464HDY-40BJ1
• Description: MODULE DDR SDRAM 512MB 200SODIMM
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT8VDDT6464HDY-40BJ1

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 400MT/s
• Features: -
• Package / Case: 200-SODIMM
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 10:
PDF: 09005aef80765fab/Source: 09005aef806e1d28
DD8C32_64x64HD.fm - Rev. E 11/08 EN
Parameter/Condition
Operating one device bank active-precharge current:
t
once per clock cycle; Address and control inputs changing once every
two clock cycles
Operating one device bank active-read-precharge current:
Burst = 4;
control inputs changing once per clock cycle
Precharge power-down standby current: All device banks idle;
Power-down mode;
Idle standby current: CS# = HIGH; All device banks idle;
t
changing once per clock cycle; V
Active power-down standby current: One device bank active;
Power-down mode;
Active standby current: CS# = HIGH; CKE = HIGH; One device bank
active;
changing twice per clock cycle; Address and other control inputs
changing once per clock cycle
Operating burst read current: Burst = 2; Continuous burst reads;
One device bank active; Address and control inputs changing once per
clock cycle;
Operating burst write current: Burst = 2; Continuous burst writes;
One device bank active; Address and control inputs changing once per
clock cycle;
per clock cycle
Auto refresh burst current
Self refresh current: CKE ≤ 0.2V
Operating bank interleave read current: Four device bank
interleaving reads; (burst = 4) with auto precharge,
t
READ or WRITE commands
RC =
CK =
CK =
t
t
t
RC (MIN);
CK (MIN); CKE = HIGH; Address and other control inputs
CK (MIN); Address and control inputs change only during active
t
RC =
t
RC =
t
t
CK =
CK =
t
RAS (MAX);
I
Values are for the MT46V16M16 DDR SDRAM only and are computed from values specified in the
256Mb (16 Meg x 16) component data sheet
DD
t
t
RC (MIN);
CK =
t
t
Specifications and Conditions – 256MB (All other Die Revisons)
CK (MIN); Iout = 0mA
CK (MIN); DQ, DM, and DQS inputs changing twice
Notes:
t
t
CK =
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing
t
t
t
t
CK =
CK (MIN); CKE = (LOW)
CK (MIN); CKE = LOW
CK =
1. Value calculated as one module rank in this operating condition; all other module ranks are
2. Value calculated reflects all module ranks in this operating condition.
in I
IN
t
t
CK (MIN); DQ, DM, and DQS inputs
CK (MIN); Iout = 0mA; Address and
= V
DD
2P (CKE LOW) mode.
REF
for DQ, DM, and DQS
256MB, 512MB (x64, DR): 200-Pin DDR SDRAM SODIMM
t
t
RFC =
RFC = 7.8125µs
t
RC =
t
RFC (MIN)
t
RC (MIN);
10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
I
I
I
I
I
I
I
DD
DD
DD
I
I
DD
DD
DD
I
I
I
DD
DD
DD
DD
DD
DD
4W
3N
5A
2P
3P
4R
2F
0
1
5
6
7
1
1
2
2
1
2
2
2
1
2
2
1
1,056
2,080
2,056
-40B
556
756
480
320
560
876
32
48
32
Electrical Specifications
2,040
1,776
-335
©2004 Micron Technology, Inc. All rights reserved.
516
736
400
240
480
896
796
32
48
32
1,880/
1,536/
-26A/
1,960
1,616
-265
200/
496
636
360
240
400
756
656
32
48
32
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA