MT46V32M16CY-5B:J Micron Technology Inc, MT46V32M16CY-5B:J Datasheet - Page 16

• Manufacturer Part Number: MT46V32M16CY-5B:J
• Description: IC SDRAM 512MB 200MHZ 60FBGA
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT46V32M16CY-5B:J

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 5ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-TFBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 7:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. O; Core DDR Rev. D 2/11 EN
Operating one-bank active-precharge current:
t
changing once per clock cycle; Address and control inputs
changing once every two clock cycles
Operating one-bank active-read-precharge current:
Burst = 4;
Address and control inputs
Precharge power-down standby current: All banks idle;
Power-down mode;
Idle standby current: CS# = HIGH; All banks are idle;
t
inputs changing once per clock
and DM
Active power-down standby current: One bank active;
Power-down mode;
Active standby current: CS# = HIGH; CKE = HIGH; One bank
active
inputs changing twice per clock cycle; Address and other
control inputs changing once per clock cycle
Operating burst read current
burst reads; One bank active; Address and control inputs
changing once per clock cycle;
Operating burst write current: Burst = 2; Continuous burst
writes;
once per clock cycle;
changing twice per clock cycle
Auto refresh burst current:
Self refresh current: CKE ≤ 0.2V
Operating bank interleave read current: Four bank
interleaving READs (burst = 4) with auto precharge,
t
control inputs change only during active READ or WRITE
commands
RC =
CK =
RC = minimum
;
t
t
RC (MIN);
CK (MIN);
t
One bank
RC =
t
RC =
t
I
V
0°C ≤ T
RAS (MAX);
DD
DD
t
t
RC allowed;
t
RC (MIN);
Q = +2.6V ±0.1V, V
CKE = HIGH; Address and other control
Specifications and Conditions (x16) Die Revision F Only
CK =
active; Address and control inputs changing
t
t
A
t
CK =
CK =
CK =
≤ +70°C; Notes: 1–5, 11, 13, 15, 47; Notes appear on pages 37–42; See also Table 10 on page 20
t
CK (MIN); DQ, DM, and DQS inputs
t
t
t
CK =
t
CK (MIN); CKE = (LOW)
CK (MIN); CKE = LOW
CK (MIN); DQ, DM, and DQS inputs
t
CK =
changing once per clock cycle
t
CK =
t
cycle; V
CK =
t
Parameter/Condition
CK (MIN); DQ, DM, and DQS
:
t
CK (MIN); I
t
Burst = 2;
CK (MIN); Address and
DD
t
CK (MIN);
IN
= +2.6V ±0.1V (-5B); V
= V
t
t
Standard
Low power (L)
RFC =
RFC = 7.8µs
REF
Continuous
OUT
I
for DQ, DQS,
OUT
t
= 0mA;
RFC (MIN)
= 0mA
16
DD
Q = +2.5V ±0.2V, V
Symbol -5B -6/6T -75E -75Z/-75
I
I
I
I
I
I
I
I
DD
DD
DD
DD
I
I
DD
I
I
I
DD
DD
DD
DD
DD
DD
DD
DD
4W
3N
5A
6A
2P
2F
3P
4R
0
1
5
6
7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
155
195
210
215
345
480
55
45
60
11
5
6
4
512Mb: x4, x8, x16 DDR SDRAM
130
160
165
195
290
405
45
35
50
10
5
5
3
Electrical Specifications – I
DD
= +2.5V ±0.2V (-6, -6T, -75E, -75Z, -75);
130
160
165
160
290
400
45
35
50
10
5
5
3
©2000 Micron Technology, Inc. All rights reserved.
115
145
145
135
280
350
40
30
45
10
5
5
3
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Notes
23, 48
23, 48
24, 33
24, 33
23, 48
28, 50
23, 49
51
23
23
50
12
12
DD