GTL2009PW,112 NXP Semiconductors, GTL2009PW,112 Datasheet - Page 15

• Manufacturer Part Number: GTL2009PW,112
• Description: IC 3-BIT FREQ COMPARATOR 16TSSOP
• Manufacturer: NXP Semiconductors

Specifications of GTL2009PW,112

• Package / Case: 16-TSSOP
• Applications: Compares FSB Frequency Inputs
• Interface: GTL, TTL
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Product: Digital Comparators
• Output Type: Complementary
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3064-5; 935278365112; GTL2009PW

Philips Semiconductors
16. Abbreviations
17. Revision history
Table 15:
9397 750 13556
Product data sheet
Document ID
GTL2009_1
Revision history
Release date
20050922
[4]
[5]
[6]
[7]
[8]
[9]
Table 14:
Acronym
CDM
ESD
FSB
GTL
HBM
LVTTL
MM
PRR
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Definition
Charged Device Model
Electrostatic Discharge
Front-Side Bus
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Rev. 01 — 22 September 2005
Change notice
-
3-bit GTL Front-Side Bus frequency comparator
Doc. number
9397 750 13556
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
-
GTL2009
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