GTL2009PW,112 NXP Semiconductors, GTL2009PW,112 Datasheet
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GTL2009PW,112
Specifications of GTL2009PW,112
935278365112
GTL2009PW
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GTL2009PW,112 Summary of contents
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GTL2009 3-bit GTL Front-Side Bus frequency comparator Rev. 01 — 22 September 2005 1. General description The GTL2009 is designed for the Nocona and Dempsey/Blackford dual Intel Xeon processor platforms to compare the Front-Side Bus (FSB) frequency settings and set ...
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Philips Semiconductors 3. Quick reference data Table amb Symbol t PLH t PHL 4. Ordering information Table 2: Type number Topside GTL2009PW 5. Functional diagram VREF 1BI1 1BI2 1BI3 1AI 2AI 2BI1 2BI2 2BI3 Fig ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for TSSOP16 6.2 Pin description Table 3: Symbol V DD VREF BO3 BO2 BO1 AO2 AO1 V SS 2BI3 2BI2 2BI1 2AI 1AI 1BI3 1BI2 1BI1 9397 750 13556 ...
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Philips Semiconductors 7. Functional description Refer to 7.1 Function tables Table 4: BSEL3 Table 5: Default on start-up is 101 Processor A FSB < B not occupied A A ...
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Philips Semiconductors 7.2 Default conditions input The FSB GTL output data is masked and a specific default value (100 MHz) is inserted upon power-up when V and valid data is supplied when the VREF input crosses a static 0.6 V ...
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Philips Semiconductors 8. Application design-in information common front-side bus Fig 3. Application diagram 8.1 Frequently asked questions Question 1: When the GTL2009 is unpowered, the LVTTL inputs may be pulled up to 3.3 V and we want to make sure ...
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Philips Semiconductors 9. Limiting values Table 9: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V (ground = 0 V). SS Symbol Parameter V supply voltage DD I input clamping current IK ...
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Philips Semiconductors 11. Static characteristics Table 11: Static characteristics Over recommended operating conditions. Voltages are referenced to V Symbol Parameter V HIGH-level output voltage; A port OH V LOW-level output voltage; A port OL LOW-level output voltage; B port I ...
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Philips Semiconductors 12. Dynamic characteristics Table 12: Dynamic characteristics V = 3 Symbol Parameter t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay PHL t LOW-to-HIGH propagation delay ...
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Philips Semiconductors 12.1 AC waveforms 1.5 V for A port and V M ref for A port and ...
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Philips Semiconductors 13. Test information Fig 10. Load circuitry for A outputs Fig 11. Load circuit for B outputs Definitions: R — load resistor L C — load capacitance includes jig and probe capacitance — termination resistance should ...
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Philips Semiconductors 14. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...
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Philips Semiconductors 15. Soldering 15.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...