LTC4306IUFD#TRPBF Linear Technology, LTC4306IUFD#TRPBF Datasheet - Page 19

• Manufacturer Part Number: LTC4306IUFD#TRPBF
• Description: IC MUX 4CH 2-WIRE BUS 24-QFN
• Manufacturer: Linear Technology

Specifications of LTC4306IUFD#TRPBF

• Applications: Multiplexer with Amplifier
• Interface: SMBus (2-Wire/I²C)
• Voltage - Supply: 2.2 V ~ 5.5 V
• Package / Case: 24-QFN
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.50 ± 0.05
PACKAGE DESCRIPTIO
3.10 ± 0.05
2.65 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
.0075 – .0098
(0.19 – 0.25)
.254 MIN
.0165 ± .0015
0.50 BSC
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.25 ±0.05
3.65 ± 0.05
4.10 ± 0.05
5.50 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
(0.406 – 1.270)
.016 – .050
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(MILLIMETERS)
INCHES
U
0.70 ±0.05
PACKAGE
OUTLINE
0° – 8° TYP
(0.38 ± 0.10)
.015 ± .004
24-Lead Plastic QFN (4mm x 5mm)
.045 ±.005
.150 – .165
(Reference LTC DWG # 05-08-1696)
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
5.00 ± 0.10
(Reference LTC DWG # 05-08-1641)
(2 SIDES)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.0250 BSC
× 45°
24-Lead Plastic SSOP
UFD Package
GN Package
PIN 1
TOP MARK
(NOTE 6)
(5.817 – 6.198)
(0.203 – 0.305)
.229 – .244
.008 – .012
4.00 ± 0.10
(2 SIDES)
TYP
.0532 – .0688
(1.35 – 1.75)
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
24
1
23
2 3
22
21
4
(8.560 – 8.738)
20
0.75 ± 0.05
5 6 7
.337 – .344*
19
(0.635)
.0250
18
BSC
17
8 9 10 11 12
16
3.65 ± 0.10
(2 SIDES)
0.200 REF
0.00 – 0.05
15 1413
(0.102 – 0.249)
.004 – .0098
(3.810 – 3.988)
.150 – .157**
GN24 (SSOP) 0204
(0.838)
BOTTOM VIEW—EXPOSED PAD
.033
REF
2.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
LTC4306
23 24
PIN 1 NOTCH
0.50 BSC
R = 0.30 TYP
0.25 ± 0.05
19
(UFD24) QFN 0505
1
2
0.40 ± 0.05
4306f