UZZ9001,118 NXP Semiconductors, UZZ9001,118 Datasheet - Page 6

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UZZ9001,118

Manufacturer Part Number
UZZ9001,118
Description
ELECTRONIC CONDITIONING SENSOR
Manufacturer
NXP Semiconductors
Type
Sensor Conditionerr
Datasheet

Specifications of UZZ9001,118

Input Type
Differential
Output Type
Digital
Interface
SPI Serial
Current - Supply
15mA
Mounting Type
Surface Mount
Package / Case
24-SOIC (0.300", 7.50mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934055833118
UZZ9001 /T3
UZZ9001 /T3
Philips Semiconductors
Table 1 SPI-Timing
2000 Nov 27
handbook, full pagewidth
1
2
3
4
5
8
9
10
11
DIAGRAM
NUMBER
Sensor Conditioning Electronic
(1) Not defined data, normally LSB of character previously transmitted.
DATA
CLK
CS
cycle time
enable lead time
enable lag time
clock high time
clock low time
access time
disable time
data valid time
(after clock edge)
data hold time
(output, after clock edge)
operating frequency
transmission delay
(time between the
leading edge of CS until
the next falling edge)
8
2
note1
PARAMETER
10
5
1
MSB-OUT
4
t
t
t
t
t
t
t
t
t
f
t
SYMBOL
cyc
lead
lag
clk_high
clk_low
acc
dis
v
h
op
delay
Fig.2 UZZ9001 SPI timing.
10
1
15
15
100
100
0
5
1.2
MIN.
6
Bits 6-1
20
25
40
1
MAX.
ns
ns
ns
ns
ns
ns
ns
ns
MHz
s
s
UNIT
11
determined by master module
determined by master module
determined by master module
determined by master module
time to data active from fixed V
state
hold time to fixed V
with 100 pF on all SPI pins
REMARKS/TEST CONDITIONS
LSB-OUT
3
Product specification
9
UZZ9001
SS
MHB699
state
SS

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