UZZ9001,118 NXP Semiconductors, UZZ9001,118 Datasheet - Page 11

no-image

UZZ9001,118

Manufacturer Part Number
UZZ9001,118
Description
ELECTRONIC CONDITIONING SENSOR
Manufacturer
NXP Semiconductors
Type
Sensor Conditionerr
Datasheet

Specifications of UZZ9001,118

Input Type
Differential
Output Type
Digital
Interface
SPI Serial
Current - Supply
15mA
Mounting Type
Surface Mount
Package / Case
24-SOIC (0.300", 7.50mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934055833118
UZZ9001 /T3
UZZ9001 /T3
Philips Semiconductors
PACKAGE OUTLINE
2000 Nov 27
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Sensor Conditioning Electronic
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT137-1
24
max.
1
2.65
0.10
Z
A
y
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E05
IEC
0.25
0.01
A
e
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
0.32
0.23
MS-013
JEDEC
c
0
REFERENCES
15.6
15.2
0.61
0.60
D
(1)
b
p
0.30
0.29
E
7.6
7.4
(1)
13
12
w
scale
0.050
EIAJ
1.27
11
5
e
M
10.65
10.00
0.419
0.394
H
c
E
0.055
1.4
A
L
2
10 mm
A
1
0.043
0.016
1.1
0.4
L
p
0.043
0.039
1.1
1.0
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
v
L
L
p
Q
0.25
0.01
w
(A )
3
Product specification
0.004
A
0.1
y
UZZ9001
A
ISSUE DATE
99-12-27
97-05-22
0.035
0.016
X
Z
0.9
0.4
v
(1)
SOT137-1
M
A
8
0
o
o

Related parts for UZZ9001,118