LMH6559MF National Semiconductor, LMH6559MF Datasheet - Page 6

• Manufacturer Part Number: LMH6559MF
• Description: IC, CLOSED LOOP BUFF SGL 1.75GHZ SOT23-5
• Manufacturer: National Semiconductor

Specifications of LMH6559MF

• No. Of Amplifiers: 1
• Gain Bandwidth: 1.75GHz
• Slew Rate: 4580V/µs
• Supply Voltage Range: 3V To 10V
• Output Current: 75mA
• Amplifier Output: Single Ended
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: No

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I
5-Pin SOT23
O
Symbol
8-Pin SOIC
3V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
Boldface limits apply at the temperature extremes.
Note 1: Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: Short circuit test is a momentary test. See next note.
Note 5: The maximum power dissipation is a function of T
(T
Note 6: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
T
Note 7: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 8: All limits are guaranteed by testing or statistical analysis.
Note 9: Positive current corresponds to current flowing into the device.
Note 10: Slew rate is the average of the positive and negative slew rate.
Note 11: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.
Connection Diagrams
Ordering Information
Package
J
J(MAX)
>
T
A
. See Applications section for information on temperature de-rating of this device.
– T
A
Linear Output Current
) / θ
JA
. All numbers apply for packages soldered directly onto a PC board.
J
= T
LMH6559MAX
LMH6559MFX
Part Number
LMH6559MA
LMH6559MF
A
Parameter
. There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where
8-Pin SOIC
Top View
20064134
Package Marking
Sourcing: V
(Note 9)
Sinking: V
(Note 9)
J(MAX)
LMH6559MA
(Continued)
B05A
, θ
J
JA
= 25˚C, V
, and T
IN
Conditions
IN
- V
- V
A
O
. The maximum allowable power dissipation at any ambient temperature is P
6
O
= −0.5V
+
= 0.5V
= 3V, V
2.5k Units Tape and Reel
1k Units Tape and Reel
3k Units Tape and Reel
−
= 0V, V
Transport Media
95 Units/Rail
(Note 8)
O
Min
−20
−13
= V
12
8
5-Pin SOT23
CM
Top View
= V
(Note 7)
+
/2 and R
Typ
−28
17
L
(Note 8)
= 100Ω to V
Max
NSC Drawing
20064135
MF05A
M08A
+
Units
/2.
mA
D
=