MC145574APB Freescale Semiconductor, MC145574APB Datasheet - Page 43

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MC145574APB

Manufacturer Part Number
MC145574APB
Description
IC TRANSCEIVER ISDN 32-LQFP
Manufacturer
Freescale Semiconductor
Type
Transceiverr
Datasheets

Specifications of MC145574APB

Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
32-LQFP
Number Of Line Interfaces
1
Control Interface
HDLC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Drivers/receivers
-
Protocol
-
Lead Free Status / Rohs Status
Not Compliant

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MOTOROLA
SCPCLK
5.2.5
SCP Rx
SCPEN
SCP Tx
Figure 5–6. Serial Control Byte Register Write Operation Double 8–Bit Transaction
DON’T CARE
When SCPEN comes low again, the next eight rising edges of SCPCLK shift data in from
SCP Rx. This data is then stored in the selected byte. Figure 5–6 illustrates this process.
SCP Merged Read/Write
Merged operations are accomplished by not taking SCPEN high between separate SCP instructions.
The SCP bytes/nibbles are strung together in a continuous bit stream and can be a mux or read/write
command. The device is able to extract the separate instructions and provide the appropriate response.
The SCPEN signal goes low at the start of the bit stream and goes high again at the end.
Figure 5–7 illustrates this process with two consecutive nibble register read operations. The merged
instructions can be a free mix of nibble/byte/read/write operations.
NOTES:
SCPCLK
SCP Rx
SCPEN
SCP Tx
1. R/W = 1 for a read operation.
2. Data is shifted out on SCP Tx on the falling edges of SCPCLK, MSB first.
3. Data is shifted into the chip from SCP Rx on the rising edges of SCPCLK, MSB first.
R/W
Figure 5–7. Merged Serial Control Port Nibble Register Read Operation
DON’T CARE
HIGH IMPEDANCE
A3
R/W
A2
A2
A1
A1
A0
MC145574
A0
HIGH IMPEDANCE
D3
DON’T CARE
DON’T CARE
D2
D1
D0
R/W
D7
IMPEDANCE
D6
A2
HIGH
D5
A1
D4
A0
D3
D3
D2
D2
DON’T CARE
D1
D1
D0
D0
IMPEDANCE
DON’T CARE
HIGH
5–5

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