CYP15G0401DXB-BGC Cypress Semiconductor Corp, CYP15G0401DXB-BGC Datasheet - Page 31

• Manufacturer Part Number: CYP15G0401DXB-BGC
• Description: IC TXRX HOTLINK 256LBGA
• Manufacturer: Cypress Semiconductor Corp
• Series: HOTlink II™r
• Type: Transceiverr

Specifications of CYP15G0401DXB-BGC

• Package / Case: 256-LBGA Exposed Pad, 32-HLBGA
• Number Of Drivers/receivers: 4/4
• Protocol: Multiprotocol
• Voltage - Supply: 3.135 V ~ 3.465 V
• Mounting Type: Surface Mount
• Product: PHY
• Supply Voltage (min): 3.135 V
• Supply Current: 1.06 A
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Channels: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: CYP15G0401DX-EVAL - IC TXRX HOTLINK 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Document #: 38-02002 Rev. *L
Table 22.
4
#
1
2
3
4
5
6
7
RXSTx = 010
(BOND_INH = LOW OR Master Channel Did Not Bond) AND (Deskew Window Expired) OR (Decoder Error)
FRAMCHAR Detected
(Elasticity Buffer Under/Overrun) OR (RX PLL Loss of Lock) OR (Any Decoder Error) OR (BOND_INH = LOW) OR
(Master Channel Did Not Bond) AND (Deskew Window Expired))
Four Consecutive FRAMCHAR Detected
(Elasticity Buffer Under/Overrun) OR (RX PLL Loss of Lock) OR (Four Consecutive Decoder Errors) OR (Invalid
Minus Valid = 4)
(Last FRAMCHAR Before a Valid Character) AND (Bonded to MASTER Channel)
(Elasticity Buffer Under/Overrun) OR (RX PLL Loss of Lock)
RESYNC_IN_SYNC
6
IN_SYNC
RXSTx=011
2
Figure 3. Status Type-B Receive State Machine for Channel Bonding
RXSTx = 111
1
RXSTx = 010
6
RXSTx = 101
Condition
5
RXSTx = 101
7
CYW15G0401DXB
CYP15G0401DXB
CYV15G0401DXB
RESYNC
RXSTx=111
NO_SYNC
3
2
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Reset
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