E-ST7538P STMicroelectronics, E-ST7538P Datasheet - Page 27

• Manufacturer Part Number: E-ST7538P
• Description: IC TXRX FSK POWER LINE 44-TQFP
• Manufacturer: STMicroelectronics
• Type: Transceiverr

Specifications of E-ST7538P

• Number Of Drivers/receivers: 1/1
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP Exposed Pad, 44-eTQFP, 44-HTQFP, 44-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Protocol: -
• Other names: 497-5332; E-ST7538P

5
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark.
ECOPACK specifications are available at: www.st.com.
5.1 Thermal and Soldering Information
Best thermal performance is acheived when slug is soldered to PCB.
It is recomended to have five solder dots (See fig. 28) without resist to connect the Copper slug to the
ground layer on the soldering side. Moreover it is recomeded to connect the ground layer on the soldering
side to another ground layer on the opposite side with 15 to 20 vias.
It is suggested to not use the PCB surface below the slug area to interconnect any pin except groung pins.
Figure 27. ST7538 Slug Drawing
Figure 28. Soldering Information
PACKAGE INFORMATION
Cu plate
A
L1
L
Solder dots
B
Solder plated
Copper Slug
L
D03IN1413
L1
If PCB with ground layer, connect copper plate
with 15 to 20 vias
L1 (Copper plate)
Package Sizes
Lead frame
A
B
L
D03IN1414
10x10x1.4mm
10.00 mm
2.00 mm
1.00 mm
6.00 mm
0.10mm ±0.05
ST7538
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