STM32L152VBT6 STMicroelectronics, STM32L152VBT6 Datasheet - Page 99

• Manufacturer Part Number: STM32L152VBT6
• Description: 16/32-BITS MICROS
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32L152VBT6

• Processor Series: STM32L152
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Program Memory Type: Flash
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: LQFP-100
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 83
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Lead Free Status / Rohs Status: Details

STM32L151xx, STM32L152xx
Table 59.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
FD
A1
A2
D1
E1
FE
D
A
E
b
e
Figure 35. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
1. Drawing is not to scale.
UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data
A1 ball
pad corner
0.46
0.06
Min
0.4
0.2
1.75
package outline
millimeters
1.75
Top view
D
0.53
0.08
0.45
0.25
0.75
0.75
Typ
5.5
5.5
0.5
7
7
Doc ID 17659 Rev 4
X
E
Y
Max
0.6
0.1
0.5
0.3
0.10
Side view
0.0181
0.0024
0.0157
0.0079
A
0.10
Min
A1
A2
Z
FD
inches
0.0209
0.0031
0.0177
0.0098
0.2756
0.2165
0.2756
0.2165
0.0197
0.0295
0.0295
Package characteristics
Typ
Bottom view
0.50
D1
(1)
0.0236
0.0039
0.0197
0.0118
Max
b
e
A0C2_ME
A1 ball
pad corner
FE
99/107
E1