DSPIC30F2012-30I/SP Microchip Technology Inc., DSPIC30F2012-30I/SP Datasheet - Page 189

• Manufacturer Part Number: DSPIC30F2012-30I/SP
• Description: DSP, 16-Bit, 12 KB Flash, 1KB RAM, 20 I/O, PDIP-28
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F2012-30I/SP

• A/d Inputs: 10-Channels, 12-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 20
• Interface: I2C, SPI, UART/USART
• Ios: 20
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 28-pin SPDIP
• Programmable Memory: 12K Bytes
• Ram Size: 1K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
dsPIC30F2011/2012/3012/3013
A
Units
eB
A2
A1
E1
B1
D
p
A
E
L
B
n
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.430
.022
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
DS70139E-page 187
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15