NTE2376 NTE Electronics, Inc., NTE2376 Datasheet - Page 2

• Manufacturer Part Number: NTE2376
• Description: MOSFET; N-Ch; VDSS 200V; RDS(ON) 0.085Ohm; ID 30A; TO-247; PD 190W; VGS +/-20V; gFS 12Mh
• Manufacturer: NTE Electronics, Inc.

Specifications of NTE2376

• Channel Type: N-Channel
• Current, Drain: 30 A
• Fall Time: 62 ns (Typ.)
• Gate Charge, Total: 140 nC
• Mounting And Package Type: M3 Screw Mounting
• Operating And Storage Temperature: -55 to +150 °C
• Package Type: TO-247
• Polarization: N-Channel
• Power Dissipation: 190 W
• Resistance, Drain To Source On: 0.085 Ohm
• Resistance, Thermal, Junction To Case: 0.65 °C⁄W
• Temperature, Operating, Maximum: +150 °C
• Temperature, Operating, Minimum: -55 °C
• Thermal Resistance, Junction To Ambient: 40 °C⁄W
• Time, Rise: 86 ns (Typ.)
• Time, Turn-off Delay: 70 ns
• Time, Turn-on Delay: 16 ns
• Transconductance, Forward: 12 Mhos
• Voltage, Breakdown, Drain To Source: 200 V
• Voltage, Forward, Diode: 2 V
• Voltage, Gate To Source: ±20 V
• Lead Free Status / Rohs Status: RoHS Compliant part

Electrical Characteristics: (T
Source–Drain Ratings and Characteristics:
Note 1. Repetitive rating; pulse width limited by maximum junction temperature.
Note 4. Pulse width
Drain–to–Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain–to–Source On–Resistance
Gate Threshold Voltage
Forward Transconductance
Drain–to–Source Leakage Current
Gate–to–Source Forward Leakage
Gate–to–Source Reverse Leakage
Total Gate Charge
Gate–to–Source Charge
Gate–to–Drain (“Miller”) Charge
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capaticance
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn–On Time
Parameter
Parameter
300 s; duty cycle
J
= +25 C unless otherwise specified)
V
Symbol
Symbol
V
R
V
(BR)DSS
t
t
(BR)DSS
I
I
I
C
C
DS(on)
Q
C
GS(th)
Q
d(on)
V
GSS
GSS
d(off)
DSS
I
Q
g
L
L
Q
t
SM
I
t
t
t
oss
on
T
rss
iss
SD
gd
S
rr
fs
gs
r
f
D
S
g
rr
J
2%.
Note 1
T
Note 4
T
di/dt = 100A/ s, Note 4
Intrinsic turn–on time is neglegible (turn–on is dominated by L
V
Reference to +25 C, I
V
V
V
V
V
V
V
I
Note 4
V
R
Between lead, .250in. (6.0) mm from
package and center of die contact
V
D
J
J
GS
GS
DS
DS
DS
DS
GS
GS
DD
GS
D
= +25 C, I
= +25 C, I
= 30A, V
= 3.2 , Note 4
= 160V, V
= V
= 50V, I
= 200V, V
= 0V, I
= 10V, I
= 20V
= –20V
= 100V, I
= 0V, V
GS
Test Conditions
Test Conditions
, I
D
DS
DS
D
D
S
F
D
= 250 A
D
GS
= 30A, V
= 30A,
= 18A, Note 4
= 18A, Note 4
= 250 A
GS
= 160V, V
= 25V, f = 1MHz
= 30A, R
= 0V, T
= 0V
D
GS
= 1mA
J
GS
G
= +125 C
= 0V,
= 6.2 ,
= 10V,
Min
200
2.0
12
Min
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2800
0.27
13.0
Typ
780
250
5.0
Typ
360
16
86
70
62
4.6
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.085
–100
Max
250
100
140
Max
4.0
540
120
25
28
74
2.0
6.9
30
–
–
–
–
–
–
–
–
–
–
–
–
S
mhos
+L
V/ C
Unit
Unit
nC
nC
nC
nH
nH
nA
nA
pF
pF
pF
ns
ns
ns
ns
ns
V
V
A
A
V
D
A
A
C
)