LTC4264IDE#PBF Linear Technology, LTC4264IDE#PBF Datasheet - Page 23

• Manufacturer Part Number: LTC4264IDE#PBF
• Description: IC CNTRLR PD INTERFACE 12-DFN
• Manufacturer: Linear Technology

Specifications of LTC4264IDE#PBF

• Controller Type: Power over Ethernet Controller (POE)
• Interface: IEEE 802.3af
• Current - Supply: 3mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 12-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -

PACKAGE DESCRIPTION
3.60 ±0.05
2.20 ±0.05
TOP MARK
1.70 ±0.05
(2 SIDES)
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
0.25 ± 0.05
4.00 ±0.10
3.30 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1695 Rev C)
12-Lead Plastic DFN (4mm × 3mm)
0.50
BSC
DE Package
0.70 ±0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
PACKAGE OUTLINE
0.00 – 0.05
R = 0.05
1.70 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
7
6
R = 0.115
3.30 ±0.05
(2 SIDES)
TYP
0.50
BSC
12
1
0.40 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0905 REV C
LTC4264
23
4264f