CY7C63803-SXC Cypress Semiconductor Corp, CY7C63803-SXC Datasheet - Page 6
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CY7C63803-SXC
Manufacturer Part Number
CY7C63803-SXC
Description
IC USB PERIPHERAL CTRLR 16-SOIC
Manufacturer
Cypress Semiconductor Corp
Series
CY7Cr
Type
USB Interface ICr
Datasheet
1.CY7C63310-SXC.pdf
(86 pages)
Specifications of CY7C63803-SXC
Package / Case
16-SOIC (3.9mm Width)
Controller Type
USB Peripheral Controller
Interface
PS2, USB
Voltage - Supply
4 V ~ 5.5 V
Current - Supply
40mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Bits
8
Operating Temperature Range
0 C to + 70 C
Propagation Delay Time Ns
50 ns
Resistance
4 Ohms to 12 Ohms
Supply Current
10 mA
Watchdog
Yes
Operating Supply Voltage
4.35 V to 5.25 V
Core Size
8 Bit
No. Of I/o's
14
Program Memory Size
8KB
Ram Memory Size
256Byte
Cpu Speed
24MHz
No. Of Timers
1
Embedded Interface Type
PS/2, USB
Digital Ic Case Style
SOIC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1001 - ISP 4PORT CYPRESS ENCORE II MCUCY4623 - KIT MOUSE REFERENCE DESIGN428-1774 - EXTENSION KIT FOR ENCORE II428-1773 - KIT DEVELOPMENT ENCORE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
428-2914-5
CY7C63803-SXC
CY7C63803-SXC
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C63803-SXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
CY7C63803-SXCT
Manufacturer:
CYPRESS
Quantity:
20 000
Table 5-1. Die Pad Summary
Document 38-08035 Rev. *N
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Pad Number
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0 CLKIN
P2.1
P2.0
VSS
PI.0 D+
P1.1 D–
VDD
P1.2 VREG
P1.3
P3.0
P3.1
P1.4
P1.5 SMOSI
P1.6 SMISO
P1.7
Reserved
Pad Name
X (microns)
–742.730
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–393.580
–795.400
537.500
723.510
723.510
723.510
723.510
723.510
723.510
696.630
736.110
736.110
736.110
736.110
1
2
3
4
5
6
7
8
9
Figure 5-2. CY7C63823 Die Form
23
Cypress Logo
10
Y
Y (microns)
–430.080
–522.980
–618.830
–714.020
–810.220
–977.930
–964.700
–936.680
–625.130
–260.670
1008.480
1023.270
792.200
699.300
606.400
336.780
438.690
532.880
635.310
728.220
839.290
911.990
53.800
X
11
22
21
20
19
18
17
16
15
14
13
12
Die step = 1792.98 μm x 2272.998 μm
Die size = 1727 μm x 2187 μm
Bond pad opening = 70 μm x 70 μm
Die thickness = 14 mils
Legend
CY7C63310, CY7C638xx
Page 6 of 86
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