CY7C63803-SXC Cypress Semiconductor Corp, CY7C63803-SXC Datasheet - Page 6

• Manufacturer Part Number: CY7C63803-SXC
• Description: IC USB PERIPHERAL CTRLR 16-SOIC
• Manufacturer: Cypress Semiconductor Corp
• Series: CY7Cr
• Type: USB Interface ICr

Specifications of CY7C63803-SXC

• Package / Case: 16-SOIC (3.9mm Width)
• Controller Type: USB Peripheral Controller
• Interface: PS2, USB
• Voltage - Supply: 4 V ~ 5.5 V
• Current - Supply: 40mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Bits: 8
• Operating Temperature Range: 0 C to + 70 C
• Propagation Delay Time Ns: 50 ns
• Resistance: 4 Ohms to 12 Ohms
• Supply Current: 10 mA
• Watchdog: Yes
• Operating Supply Voltage: 4.35 V to 5.25 V
• Core Size: 8 Bit
• No. Of I/o's: 14
• Program Memory Size: 8KB
• Ram Memory Size: 256Byte
• Cpu Speed: 24MHz
• No. Of Timers: 1
• Embedded Interface Type: PS/2, USB
• Digital Ic Case Style: SOIC
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1001 - ISP 4PORT CYPRESS ENCORE II MCUCY4623 - KIT MOUSE REFERENCE DESIGN428-1774 - EXTENSION KIT FOR ENCORE II428-1773 - KIT DEVELOPMENT ENCORE II
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 428-2914-5; CY7C63803-SXC

Table 5-1. Die Pad Summary
Document 38-08035 Rev. *N
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Pad Number
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0 CLKIN
P2.1
P2.0
VSS
PI.0 D+
P1.1 D–
VDD
P1.2 VREG
P1.3
P3.0
P3.1
P1.4
P1.5 SMOSI
P1.6 SMISO
P1.7
Reserved
Pad Name
X (microns)
–742.730
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–755.060
–393.580
–795.400
537.500
723.510
723.510
723.510
723.510
723.510
723.510
696.630
736.110
736.110
736.110
736.110
1
2
3
4
5
6
7
8
9
Figure 5-2. CY7C63823 Die Form
23
Cypress Logo
10
Y
Y (microns)
–430.080
–522.980
–618.830
–714.020
–810.220
–977.930
–964.700
–936.680
–625.130
–260.670
1008.480
1023.270
792.200
699.300
606.400
336.780
438.690
532.880
635.310
728.220
839.290
911.990
53.800
X
11
22
21
20
19
18
17
16
15
14
13
12
Die step = 1792.98 μm x 2272.998 μm
Die size = 1727 μm x 2187 μm
Bond pad opening = 70 μm x 70 μm
Die thickness = 14 mils
Legend
CY7C63310, CY7C638xx
Page 6 of 86
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