MCP2510-E/SO Microchip Technology, MCP2510-E/SO Datasheet - Page 66

• Manufacturer Part Number: MCP2510-E/SO
• Description: IC CAN CTLR EXTENDED TEMP 18SOIC
• Manufacturer: Microchip Technology

Specifications of MCP2510-E/SO

• Controller Type: CAN Interface
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply: 10mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 18-SOIC (7.5mm Width)
• No. Of Tx Buffers: 3
• No. Of Rx Buffers: 2
• No. Of Filters: 6
• No. Of Masks: 2
• No. Of Interrupts: 1
• Supply Voltage Range: 3V To 5.5V
• Digital Ic Case Style: SOIC
• No. Of Pins: 18
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV251001 - KIT DEVELOPMENT CAN MCP2510
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP2510
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21291F-page 66
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
eB
e
A2
A1
E1
b1
N
A
E
D
e
L
c
b
E1
A2
.115
.015
.300
.240
.880
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.900
.130
.060
.018
.130
.250
.010
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c