XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 5

MCU HOST PROCESSOR 352-TBGA

XPC8240RZU250E

Manufacturer Part Number
XPC8240RZU250E
Description
MCU HOST PROCESSOR 352-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of XPC8240RZU250E

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
250MHz
Embedded Interface Type
I2C
Digital Ic Case Style
TBGA
No. Of Pins
352
Supply Voltage Range
2.5V To 2.75V
Rohs Compliant
No
Family Name
MPC82XX
Device Core Size
32b
Frequency (max)
250MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.625/2.6255V
Operating Supply Voltage (max)
2.75625/2.756775V
Operating Supply Voltage (min)
2.49375/2.494225V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
352
Package Type
TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

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1.3
The following list provides a summary of the general parameters of the MPC8240:
1.4
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8240.
1.4.1
The following sections describe the MPC8240 absolute maximum ratings, recommended operating
conditions, DC electrical specifications, output driver characteristics, and power data characteristics.
1.4.1.1
The tables in this section describe the MPC8240 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Supply voltage—CPU core and peripheral logic
Supply voltage—memory bus drivers
Supply voltage—PCI and standard I/O buffers
Supply voltage—PLLs and DLL
Supply voltage—PCI reference
Input voltage
Operational die-junction temperature range
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only,
2. PCI inputs with LV
MPC8240 Integrated Processor Hardware Specifications
and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device
reliability or cause permanent damage to the device.
Technology
Die size
Transistor count
Logic design
Packages
Core power supply 2.5 V ± 5% V DC (nominal; see Table 2 for recommended operating
I/O power supply
General Parameters
Electrical and Thermal Characteristics
DC Electrical Characteristics
2
Absolute Maximum Ratings
DD
Characteristic
= 5 V ± 5% V DC may be correspondingly stressed at voltages exceeding LV
Freescale Semiconductor, Inc.
0.29-µm CMOS, five-layer metal
73 mm
3.1 million
3.0- to 3.6-V DC
Fully-static
Surface mount 352 tape ball grid array (TBGA)
conditions)
For More Information On This Product,
Table 1. Absolute Maximum Ratings
1
2
Go to: www.freescale.com
AV
DD
/AV
Symbol
LVD
OV
GV
V
T
V
DD
T
stg
DD
in
DD
DD
j
DD
2/LAV
DD
–0.3 to 2.75
–0.3 to 2.75
–0.3 to 3.6
–0.3 to 3.6
–0.3 to 5.4
–0.3 to 3.6
–55 to 150
0 to 105
General Parameters
Range
DD
+ 0.5 V DC.
Unit
°C
°C
V
V
V
V
V
V
5

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