XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 27

• Manufacturer Part Number: XPC8240RZU250E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240RZU250E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 250MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core Size: 32b
• Frequency (max): 250MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.625/2.6255V
• Operating Supply Voltage (max): 2.75625/2.756775V
• Operating Supply Voltage (min): 2.49375/2.494225V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

1.4.3
Table 16 provides the package thermal characteristics for the MPC8240.
1.5
The following sections provide the package parameters and mechanical dimensions for the MPC8240, 352
TBGA package.
1.5.1
The MPC8240 uses a 35 mm × 35 mm, cavity-down, 352 pin tape ball grid array (TBGA) package. The
package parameters are as provided in the following list.
MPC8240 Integrated Processor Hardware Specifications
Die junction-to-case thermal resistance
Die junction-to-board thermal resistance
Note:
1. Refer to Section 1.7, “System Design Information,” for details about thermal management
Package outline
Interconnects
Pitch
Solder balls
Solder ball diameter
Maximum module height
Co-planarity specification
Maximum force
Package Description
Thermal Characteristics
Package Parameters
Characteristic
Freescale Semiconductor, Inc.
Table 16. Package Thermal Characteristics
For More Information On This Product,
35 mm × 35 mm
352
1.27 mm
ZU (TBGA)—62 Sn/36 Pb/2 Ag
VV (Lead free version of TBGA package)—95.5 Sn/4.0 Ag/0.5 Cu
0.75 mm
1.65 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
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1
Symbol
R
R
θJC
θJB
.
Package Description
Value
1.8
4.8
°C/W
°C/W
Unit
27