MPC8379EVRAJF Freescale Semiconductor, MPC8379EVRAJF Datasheet - Page 88

MPU PWRQUICC II 533MHZ 689TEPBGA

MPC8379EVRAJF

Manufacturer Part Number
MPC8379EVRAJF
Description
MPU PWRQUICC II 533MHZ 689TEPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8379EVRAJF

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
689-TePBGA II
Maximum Clock Frequency
533 MHz
Operating Supply Voltage
1.8 V to 2.5 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
DUART, HSSI, I2C, IPIC, JTAG, SPI, USB
Digital Ic Case Style
BGA
No. Of Pins
689
Rohs Compliant
Yes
For Use With
MPC8377E-RDBA - BOARD REF DES MPC8377 REV 2.1MPC8377E-MDS-PB - BOARD MODULAR DEV SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package and Pin Listings
21.3
Figure 62
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below in
this document based on the application usage:
Note that an external AC coupling capacitor is required for the above three serial transmission protocols
with the capacitor value defined in specification of each protocol section.
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
22.1
The package parameters are provided in the following list. The package type is 31 mm × 31 mm,
689 plastic ball grid array (TePBGA II).
88
Section 8, “Ethernet: Enhanced Three-Speed Ethernet (eTSEC)”
Section 15, “PCI Express”
Section 16, “Serial ATA (SATA)”
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
SerDes Transmitter and Receiver Reference Circuits
Package Parameters for the MPC8377E TePBGA II
shows the reference circuits for SerDes data lane’s transmitter and receiver.
Transmitter
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Figure 62. SerDes Transmitter and Receiver Reference Circuits
50 Ω
50 Ω
SD1_TXn or
SD2_TXn
SD1_TXn or
SD2_TXn
689
1.00 mm
3.5% Ag, 96.5% Sn
0.60 mm
31 mm × 31 mm
2.0 mm to 2.46 mm (maximum)
SD1_RXn or
SD2_RXn
SD1_RXn or
SD2_RXn
50 Ω
50 Ω
Receiver
Freescale Semiconductor

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