MPC8379EVRAJF Freescale Semiconductor, MPC8379EVRAJF Datasheet - Page 20

• Manufacturer Part Number: MPC8379EVRAJF
• Description: MPU PWRQUICC II 533MHZ 689TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8379EVRAJF

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 689-TePBGA II
• Maximum Clock Frequency: 533 MHz
• Operating Supply Voltage: 1.8 V to 2.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 533MHz
• Embedded Interface Type: DUART, HSSI, I2C, IPIC, JTAG, SPI, USB
• Digital Ic Case Style: BGA
• No. Of Pins: 689
• Rohs Compliant: Yes
• For Use With: MPC8377E-RDBA - BOARD REF DES MPC8377 REV 2.1MPC8377E-MDS-PB - BOARD MODULAR DEV SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

DDR1 and DDR2 SDRAM
The minimum frequency for DDR2 is 250 MHz data rate (125 MHz clock), 167 MHz data rate (83 MHz
clock) for DDR1.
20
MDQ//MDM output setup with respect to MDQS
MDQ//MDM output hold with respect to MDQS
MDQS preamble start
MDQS epilogue end
Note:
1
2
3
4
5
6
7
8
The symbols used for timing specifications follow the pattern of t
inputs and t
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
(A) are setup (S) or output valid time. Also, t
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ//MDM/MDQS.
Note that t
from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). t
of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in
the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC8379E PowerQUICC II Pro Host Processor Reference Manual for a description and
understanding of the timing modifications enabled by use of these bits.
Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data MDQ, ECC, or
data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
All outputs are referenced to the rising edge of MCKn at the pins of the microprocessor. Note that t
conventions described in Note 1.
Clock Control register is set to adjust the memory clocks by 1/2 the applied cycle.
See AN3665, “MPC837xE Design Checklist,” for proper DDR termination.
DDKHAS
symbolizes DDR timing (DD) for the time t
DDKHMH
(first two letters of functional block)(reference)(state)(signal)(state)
Table 21. DDR1 and DDR2 SDRAM Output AC Timing Specifications (continued)
Parameter
follows the symbol conventions described in Note 1. For example, t
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
400 MHz data rate
333 MHz data rate
266 MHz data rate
200 MHz data rate
400 MHz data rate
333 MHz data rate
266 MHz data rate
200 MHz data rate
DDKLDX
Symbol
t
t
MCK
t
t
t
t
DDKHDS,
DDKHDX,
DDKHMP
DDKHME
DDKLDS
DDKLDX
symbolizes DDR timing (DD) for the time t
memory clock reference (K) goes from the high (H) state until outputs
1
–0.5 × t
(first two letters of functional block)(signal)(state) (reference)(state)
for outputs. Output hold time can be read as DDR timing
1100
1200
1100
1200
–0.6
Min
550
800
700
800
MCK
–0.6
DDKHMH
DDKHMH
–0.5 × t
can be modified through control
Max
0.6
describes the DDR timing (DD)
—
—
—
—
—
—
—
—
MCK
MCK
DDKHMP
+ 0.6
memory clock reference
Freescale Semiconductor
follows the symbol
Unit
ps
ps
ns
ns
Notes
5, 8
5, 8
6, 8
6, 8
for