MC7447ATHX1000NB Freescale Semiconductor, MC7447ATHX1000NB Datasheet - Page 43
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MC7447ATHX1000NB
Manufacturer Part Number
MC7447ATHX1000NB
Description
IC MPU RISC 1000MHZ 360-FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7447AVS733NB.pdf
(56 pages)
Specifications of MC7447ATHX1000NB
Processor Type
MPC74xx PowerPC 32-Bit
Speed
1.0GHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
360-FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC7447ATHX1000NB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
9.8
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7447A implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see
“Power Consumption with DFS Enabled,”
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see
attachment through the printed-circuit board is suggested. In any implementation of a heat sink solution,
the force on the die should not exceed ten pounds.
Freescale Semiconductor
Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Management Information
Figure 20
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
and
Interface Material
Figure
Heat Sink
Thermal
Heat Sink
21); however, due to the potential large mass of the heat sink,
Clip
for specific information regarding power reduction and DFS.
Printed-Circuit Board
Section 9.8.4, “Temperature Diode,”
NOTE
Figure 21
HCTE BGA Package
below.
System Design Information
for more
Section 9.8.5.1,
43